Radio frequency bias circuit packaging structure

Abstract

The invention provides a radio frequency bias circuit packaging structure. The radio frequency bias circuit packaging structure comprises a packaging part, and a power amplifier is packaged in the packaging part; the radio frequency bias circuit packaging structure further comprises a radio frequency bias circuit which comprises a radio frequency choke component, and the port, electrically connected with the output load, of the power amplifier is electrically connected with a direct current bias voltage source through the radio frequency choke component; the packaging part covers the radio frequency choke component. According to the technical scheme of the invention, the connection relationship between the radio frequency choke component and the power amplifier is realized; the radio frequency signal is prevented from influencing the characteristics of a direct current bias voltage source, and the problem that the power amplifier module occupies a large area of a printed circuit boarddue to the fact that the radio frequency bias circuit is provided with a long bias line on the printed circuit board is solved; the size of the power amplifier module is reduced, and the integration level of the printed circuit board is improved.

Description

technical field [0001] Embodiments of the present invention relate to the field of packaging, and in particular to a packaging structure of a radio frequency bias circuit. Background technique [0002] The power amplifier is an important part of the wireless communication system. The power amplifier is used to amplify the input signal and then output it. During the process of performing the amplification function of the power amplifier, the power amplifier converts DC energy into radio frequency energy. [0003] At present, it is difficult to integrate the power amplifier module with other modules. Most of the power amplifier modules are connected to the whole system in the form of a separate module, which makes the power amplifier module occupy a larger size of the wireless communication system, which is not conducive to wireless The miniaturization of the whole communication system. In addition, the traditional power amplifier needs to be equipped with a bias circuit that...

AI Technical Summary

Problems solved by technology

[0003] At present, it is difficult to integrate the power amplifier module with other modules. Most of the power amplifier modules are connected to the whole system in the form of a separate module, which makes the power amplifier module occupy a larger size of the wireless communication system, which is not conducive to wireless Miniaturization of the complete communication system

In addition, the traditional power amplifier needs to be equipped with a bias circuit that cooperates with the power amplifier to provide a bias voltage for the power amplifier to perform the amplification function. However, the bias circuit of the power amplifier currently used needs to be introduced on the printed circuit board. Longer bias lines, and longer bias lines occupy a larger area of ​​the printed circuit board, and the integration level of the printed circuit board is low

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