Heat dissipation module

Abstract

A heat dissipation module is used for solving the problem that the heat dissipation efficiency is poor due to the fact that a bent structure of an existing heat dissipation module is exposed, and comprises at least one heat pipe which is provided with a bent part located between an evaporation part and a condensation part; the at least one heat conduction plate is connected with the bent part of the heat pipe; and the radiating fin group is positioned at the condensation part of the heat pipe.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module capable of dissipating heat through heat transfer of heat pipes. Background technique [0002] The existing electronic components such as the central processing unit will generate a large amount of heat energy during operation, which will cause the temperature of itself to rise, so a heat dissipation module will be added to the electronic components, and the existing heat dissipation module uses a heat sink to use The heat generated by the electronic component is absorbed, and the absorbed heat is introduced into a heat dissipation fin group through a heat pipe to dissipate the heat, so that the heat dissipation module can dissipate heat from the electronic component. [0003] However, the heat pipe of the existing heat dissipation module transfers heat by penetrating through the heat dissipation fin group. The set of cooling fins must be exposed, resulting ...

AI Technical Summary

Problems solved by technology

[0003] However, the heat pipe of the existing heat dissipation module transfers heat by penetrating through the heat dissipation fin group. The heat dissipation fin group must be exposed, resulting in poor heat dissipation efficiency of the heat dissipation module at the bent structure

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