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Targeted recall of semiconductor devices based on manufacturing data

A targeted, semi-conductive technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc.

Pending Publication Date: 2020-10-30
KLA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, accurately predicting device failures to provide targeted recalls remains an ongoing challenge

Method used

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  • Targeted recall of semiconductor devices based on manufacturing data
  • Targeted recall of semiconductor devices based on manufacturing data
  • Targeted recall of semiconductor devices based on manufacturing data

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Embodiment Construction

[0019] Reference will now be made in detail to the disclosed subject matter which is illustrated in the accompanying drawings. The invention has been particularly shown and described with respect to certain embodiments and specific features thereof. The embodiments set forth herein are to be regarded as illustrative rather than restrictive. It will be readily apparent to those skilled in the art that various changes and modifications in form and details can be made without departing from the spirit and scope of the invention.

[0020] Embodiments of the invention are directed to systems and methods for providing targeted recall of semiconductor devices based on overall manufacturing data.

[0021] In some embodiments, a manufacturing fingerprint (e.g., a fingerprint) is formed to incorporate and / or track data related to the manufacturing history of a semiconductor device, such as, but not limited to, fabrication profiles, in-line measurement profiles, packaging test profiles,...

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PUM

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Abstract

A system for providing a targeted recall includes a metrology sub-system for performing in-line measurements on semiconductor dies after one or more fabrication steps to generate in-line measurement profiles, a failure analysis sub-system for determining a manufacturing fingerprint of a failed die, and a controller. The metrology sub-system may further perform one or more measurements of the semiconductor dies after one or more packaging steps to generate package characterization profiles. The controller may generate manufacturing fingerprints for the semiconductor dies based on the in-line measurement profiles and the package characterization profiles, which are referenced to unique electronic chip identifiers. The controller may further identify at-risk dies by comparing the manufacturing fingerprints of the semiconductor dies with the manufacturing fingerprint of the failed die and direct a targeted recall for the one or more at-risk dies.

Description

[0001] Cross References to Related Applications [0002] This application is based on 35 U.S.C. §119(e) claim filed on March 20, 2018, titled "METHOD TO ENABLETARGETED RECALL OF AT RISK SEMICONDUCTOR DEVICES USING HOLISTIC MANUFACTURING DATA AND MACHINE LEARNING)" and designating Robert J. Rathert and David W. Price as inventors with serial number 62 / 645,406 Benefit of U.S. Provisional Application, which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to recall of semiconductor devices, and more particularly to targeted recall of semiconductor devices based on manufacturing data. Background technique [0004] Product recalls due to failures of semiconductor devices are often costly and disruptive to both businesses and consumers. It is therefore desirable to limit recalls to semiconductor devices that are expected to fail in order to mitigate associated costs and damage. Typical product recalls are based on gros...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/66
CPCG01R31/2831G06Q30/014H01L22/12H01L22/14H01L22/20H01L23/544H01L2223/54433G01R31/2894H01L21/67242H01L22/10H01L22/30H01L22/34
Inventor R·J·拉瑟D·W·普利斯
Owner KLA CORP