22 results about "Measurement Profiles" patented technology

The invention relates to a robot three-dimensional surface type measurement system and a parameter calibration method. The method comprises the following steps: defining a coordinate system of the measurement system; the three-dimensional surface type measuring head calibration sub-method comprises the following steps of: optimizing a sphere center coordinate of a calibration sphere in a three-dimensional surface type measuring head coordinate system, and translating a three-dimensional surface type measuring head to obtain a plurality of groups of point pairs between the three-dimensional surface type measuring head coordinate system and a robot base coordinate system; a multispectral confocal probe calibration sub-method: points on the surface of the sphere are converted to a robot end coordinate system through an optimized multispectral confocal probe conversion matrix and then are converted to a robot base coordinate system, so that accurate alignment of the multispectral confocal probe coordinate system and the robot base coordinate system is realized; and fusing the measurement data under the robot base coordinate system by adopting a combined probe data fusion algorithm. Compared with the prior art, the method has the advantages of eliminating system errors caused by installation of the combined measuring head, improving fusion precision and the like.

The invention discloses a three-dimensional pressure and surface type measurement method and device based on structured light and pressure-sensitive paint. The method comprises the following steps: spraying the pressure-sensitive paint on an object to be measured; building a dual-mode camera imaging system; burning a pre-generated structured light fringe pattern to a DLP projector; a first camera, a second camera and a DLP projector are calibrated; using a DLP projector to project structured light to the surface of the to-be-detected object coated with the pressure-sensitive paint in a wind tunnel environment to excite the pressure-sensitive paint to emit red light; wavelength separation is carried out by using a semi-transparent and semi-reflective mirror, and a surface type image and a pressure image are respectively acquired by using a first camera and a second camera; processing the surface type image and the pressure image to respectively obtain three-dimensional point cloud data and a two-dimensional pressure pseudo-color image; and based on the three-dimensional point cloud data and the two-dimensional pressure pseudo-color image, obtaining a three-dimensional coordinate and a pressure value of each pixel point on the surface of the to-be-measured object. Through the combination of the structured light and the pressure-sensitive paint, the non-contact measurement technology is adopted, and the pressure and surface type data of the to-be-measured object can be synchronously and accurately obtained.

A computer-implemented method for preemptive obstacle detection and tracking in an environment includes the steps: a) constructing a power-angle measurement profile based on signal power indicators (SPIs) within a time interval, the SPIs including a measured power of each signal received via a reconfigurable intelligent surface (RIS) of a plurality of RISs located within the environment; b) mapping a reduction in the measured power in the power-angle measurement profile to a first RIS associated with a first angular sector of the environment to predict a presence of an obstacle therein; and c) updating a coordination plan associated with the RISs based on feedback to track the obstacle. Steps a)-c) are iteratively repeated to predict a presence of the obstacle in further angular sectors. A predicted trajectory of the obstacle is extrapolated over time based on the predicted presence of the obstacle in the angular sectors.

The invention relates to a leak detection method (100) comprising: - a learning step (101) during which at least one reference measurement signal representative of the flow or concentration of tracer gas in a reference object (A) to be tested or in an environment surrounding a reference object (A) to be tested is measured during at least one leaktightness monitoring cycle (C), - a plurality of successive test steps (102) during which a leak detector (1) is used to measure a measurement profile representative of the flow or concentration of tracer gas during at least one leaktightness monitoring cycle (C) and the measurement profile is compared against the reference profile in order, depending on the result of the comparison, to provide a similarity indicator from which the presence of an anomaly can be deduced.

The invention provides a measuring system and method, an upper computer, a storage medium and a program product, the measuring system comprises a fixing tool, the fixing tool comprises a fixing flat plate and a negative pressure interface, the fixing flat plate is provided with an embedding groove used for fixing a to-be-measured part, and the embedding groove is communicated with the negative pressure interface through a negative pressure pipeline; the surface profile measuring equipment is used for collecting surface profile information of the to-be-measured part; the upper computer is used for processing the surface profile information according to a preset measurement rule to obtain three-dimensional data of the to-be-measured part; the preset measurement rule defines a corresponding relation among the to-be-measured three-dimensional data, the measurement section and the measurement strategy in the to-be-measured part. The system can improve the measurement precision of the to-be-measured part.

A processing device (400) for performing non-negative matrix factorization on measured X-ray powder diffraction profiles comprises a measurement profile acquisition section (410) for acquiring a plurality of measured profiles, a decomposition section (420) for applying non-negative matrix factorization to the measured profiles and for calculating base profiles; an index calculation section (430) for acquiring the base profiles and for calculating indices based on a non-uniformity of the base profiles; a base profile classification section (440) for classifying the base profiles into a plurality of groups based on the indices; and a base profile correction section (450) for performing a correction based on the indices on at least one of the plurality of groups and for calculating a corrected base profile.

A system may include a lateral shearing interferometer. The lateral shearing interferometer may enable measuring a surface profile of a sample, such as the pattern wafers, using reflected light from the sample. The reflected light may be reflected at a grazing incidence angle. A controller may receive images from the lateral shearing interferometer and measure the surface profile. The controller may measure the surface profile by reconstructing a phase of the reflected light from the images. The controller may reconstruct the phase using spatial reconstruction or time-domain reconstruction. The gratings may allow the controller to measure the edge roll-off in one or two dimensions. The controller may also calibrate the grazing incidence angle and determine refractive indices of thin-films on the sample. The controller may also perform full measurements of the surface profile using line beams, rectangular beams, or full-sample beams.

The present disclosure relates to a surface profile measurement system and method. The surface profile measurement system comprises a displacement stage for carrying a reference sample and a sample and moving the reference sample and the sample. A white light interferometry module is configured to acquire a sequence of white light interference images at each measurement position on the surface of the sample to extract initial height data of different measurement points at each measurement position. A laser interferometry positioning module is configured to acquire a positioning interference image of the corresponding measurement position while the white light interferometry module acquires the sequence of white light interference images. A host computer is in signal connection with the displacement stage, the laser interferometry positioning module and the white light interferometry module, respectively. The host computer compensates the initial height data corresponding to the corresponding measurement points based on the positional offset of the positioning interference image of each measurement position relative to a reference interference image to obtain the height measurement value of each measurement point on the surface of the sample in the scanning direction, thereby eliminating the defocus error of the displacement stage.

The invention discloses a method for positioning colloid defects. The method comprises the steps that a calibration piece is scanned through two line laser contour scanners at the tail end of a robot, left side data and right side data are spliced to obtain measurement contour data, the measurement contour data and actual contour data of the calibration piece are compared to obtain a comparison result, and the angles of the line laser contour scanners are adjusted through the comparison result; during gluing, a line laser contour scanner scans glue, after left side data and right side data are spliced, the curvature value of each discrete point is calculated, and when the curvature value exceeds a dynamic threshold value, the discrete points are determined as suspected defect points; and obtaining the colloid height and the colloid width of the spliced data, comparing the colloid height and the colloid width with a preset gluing standard, and judging whether the colloid has a defect in volume or not. According to the invention, the problems of too high misjudgment rate of gluing defects and inaccurate defect positioning in the prior art are solved.

The invention relates to a high-precision cutting device for a large-diameter high-strength steel cylinder structure, and belongs to the field of numerical control profiling machining of large cylinder structures. The device comprises a driving unit, a tool bit, a measurement profiling unit and a numerical control unit, the driving unit is used for driving the tool bit to perform six-degree-of-freedom motion so as to cut a workpiece; the measurement profiling unit is used for measuring the surface of the workpiece to obtain the actual shape of the surface of the workpiece; the numerical control unit is used for generating a tool bit machining path according to the obtained actual morphology of the workpiece surface. According to the invention, six-degree-of-freedom multi-axis movement of the tool bit can be realized. The numerical control unit generates a self-adaptive machining path through a trajectory planning and compensation algorithm, dynamic trajectory correction is achieved through the multi-axis linkage control module, the method can adapt to the situation of workpiece field deformation, adjustment flexibility is good, field machining efficiency and adaptability are remarkably improved, and machining precision is improved. And meanwhile, the problem of insufficient cutting precision caused by ovality and local deformation of a large-diameter cylinder is solved.

An integrated multiplex measurement system for measuring semiconductor objects includes a main body, a fringe interferometer, a white light interferometer probe, and a color conjugate focal measurement probe. The fringe interferometer, white light interferometer probe, and color conjugate focal measurement probe are housed within the main body. The fringe interferometer can be used to measure the warp, unevenness, color, brightness distribution, shape, and high-nitrogen region distribution of the semiconductor object. The white light interferometer probe and color conjugate focal measurement probe are located at one point. The white light interferometer probe can measure the surface roughness and surface depth of the semiconductor object, while the color conjugate focal measurement probe can measure the surface roughness and thickness of the semiconductor object. It can accurately measure the surface roughness of the semiconductor object using confocal imaging dispersion analysis technology, and can also perform surface profile measurements, including fine curvature and structural features. This invention integrates multiple measuring devices into one machine, which can be used separately or together, thus facilitating the measurement of semiconductor objects.

The invention relates to a large-depth-diameter-ratio inner hole coaxiality measuring device coupled with five system errors, belongs to the technical field of surface profile measurement, and aims to solve the problem that a traditional measuring device cannot measure inner surface profile data and cannot evaluate surface profile coaxiality due to the fact that a probe cannot penetrate into a part. Comprising a shaft sleeve, a main shaft, a table top, a lower bottom plate, a stator, a stator seat, a laser sensor support, a laser sensor, a laser sensor adapter seat, a lifting mechanism, a lifting table supporting plate, a concentric positioning device, a new adapter piece, a rotor pressing lower plate, a rotor, a 3DModel RESx255mm Asectionring, a stator supporting upper plate, a reading head support, a reading head for a coaxiality device, a base, an air floating shaft sleeve adapter plate and a top cover.

The invention provides a polishing solution detection method and a polishing solution detection system, and the method comprises the following steps: providing a substrate, and coating the surface of the substrate with a polishing solution; the substrate is dried at a preset temperature, and a first slurry film is formed on the surface of the substrate; performing surface profile measurement on the first slurry film to obtain surface profile information of the first slurry film, and performing two-dimensional Fourier transform analysis on the surface profile information of the first slurry film; the steps of polishing solution coating and drying treatment are repeatedly executed on the surface of the first slurry film, and a second slurry film with the preset thickness is formed on the surface of the substrate; performing surface profile measurement on the second slurry film to obtain surface profile information of the second slurry film, and performing two-dimensional Fourier transform analysis; and performing SEM detection and EDS / EDX material analysis on the second slurry film. According to the polishing solution detection method, the polishing quality can be accurately evaluated, optimization of CMP process parameters is facilitated, and the polishing quality and the production efficiency are improved.

A leak detection method (100) comprising: - a learning step (101) during which at least one reference measurement signal representative of the flow or concentration of tracer gas in a reference test object (A) or in an environment surrounding a reference test object (A) is measured during at least one leak test cycle (C), - a plurality of successive test steps (102) during which a measurement profile representative of the flow or concentration of tracer gas is measured using the leak detector (1) during at least one leak test cycle (C) and compared with the reference profile to provide, based on the result of the comparison, a similarity indicator allowing the presence of an anomaly to be deduced. Figure 1

The invention relates to a method for measuring the surface profile of a nanostructure, and the method comprises the following steps: S100, constructing a scattering intensity calculation model of a target nanostructure, the scattering intensity calculation model comprising key structure parameters used for describing the surface profile; s200, performing a small-angle X-ray scattering experiment on the sample with the target nanostructure to obtain scattering experiment data of the target nanostructure; and S300, fitting the scattering intensity calculation model by using the scattering experiment data to obtain key structure parameters of the target nanostructure. The method for measuring the surface profile of the nanostructure does not need complex sample pretreatment, is non-destructive, high in efficiency and high in accuracy, and provides a brand new technical scheme for high-precision measurement of the nanostructure in the field of semiconductor manufacturing.

The application relates to a nanostructure surface profile measurement method, which comprises the following steps: S100, constructing a scattering intensity calculation model of a target nanostructure, wherein the scattering intensity calculation model comprises key structure parameters for describing a surface profile; S200, performing a small-angle X-ray scattering experiment on a sample with the target nanostructure to obtain scattering experiment data of the target nanostructure; and S300, fitting the scattering intensity calculation model by using the scattering experiment data to obtain key structure parameters of the target nanostructure. The nanostructure surface profile measurement method provided by the application does not need complex sample pretreatment, and has non-destructiveness, high efficiency and high accuracy, and provides a novel technical scheme for high-precision measurement of nanostructures in the field of semiconductor manufacturing.

This application discloses a surface profile measurement method, apparatus, device, storage medium, and product, relating to the field of optical surface measurement technology. The surface profile measurement method includes: irradiating a target light beam onto a dispersive confocal lens, separating light rays of different wavelengths in the target light beam through the dispersive confocal lens; controlling a two-axis motion platform to move the surface to be measured to different preset sampling points, and collecting the reflected signals obtained by the light irradiating the surface to be measured point by point; determining the target signal with the strongest signal among the reflected signals, and determining the distance between the surface to be measured and the dispersive confocal lens based on the wavelength corresponding to the target signal; determining the point cloud of the surface to be measured based on the distance, fitting the point cloud of the surface to be measured to obtain the fitted planar profile, and measuring the surface profile of the fitted planar profile to obtain the measurement result. This application does not require operators to have a high level of technical expertise, reducing the difficulty of use.

A leak detection method (100) comprising: - a learning step (101) during which at least one reference measurement signal representative of the flow or concentration of tracer gas in a reference test object (A) or in an environment surrounding a reference test object (A) is measured during at least one leak test cycle (C), - a plurality of successive test steps (102) during which a measurement profile representative of the flow or concentration of tracer gas is measured using the leak detector (1) during at least one leak test cycle (C) and compared with the reference profile to provide, based on the result of the comparison, a similarity indicator allowing the presence of an anomaly to be deduced. Figure 1

The invention provides a method for automatically generating a steel rail polishing mode, which comprises the following steps of: aligning an actual measurement profile of a steel rail with a target profile of the steel rail by taking the target profile of the steel rail as a reference; forming a designed and polished target profile of the steel rail based on the target profile of the steel rail; the designed and polished target profile is formed by connecting a plurality of line segments which are connected in sequence; according to the aligned actual measurement profile and the designed polished target profile, the position and the area of a to-be-polished area of the steel rail are calculated and determined; establishing a relationship between the grinding power and the grinding area of a single grinding wheel of the steel rail grinding wagon; and aiming at eliminating the area of the to-be-polished area of the steel rail, automatically generating a polishing mode based on the relationship between the polishing power of a single grinding wheel of the steel rail polishing wagon and the polishing area of the single grinding wheel. The technical problem that according to traditional steel rail grinding, the to-be-ground area needs to be manually confirmed, and the grinding mode needs to be determined according to grinding experience is solved.

The invention discloses a high-pressure compressor standard rotor contour measurement method based on shaft and diameter double references, belongs to the technical field of contour measurement, and solves the problems that the surface contour measurement of a high-pressure compressor standard rotor assembly and all levels of components thereof is inaccurate, the machining quality of all levels of components of a high-pressure compressor standard rotor cannot be accurately evaluated, and the assembly process cannot be accurately guided. The method comprises the following steps: placing a high-pressure compressor standard rotor part on a measuring device turntable, and adjusting the eccentricity and inclination of the lower end surface to an expected state through a knob; an axial measuring sensor and a radial measuring sensor which are driven by the two horizontal guide rails at the upper part are respectively arranged on an axial measuring surface and a radial measuring surface of the standard rotor part of the high-pressure compressor, and then measurement is started; surface runout data collected by the inductive displacement sensor are substituted into a formula, and final axial and radial measurement results are calculated; and evaluating the geometric parameters of the standard rotor part according to the axial-radial bidirectional measurement data. The method is suitable for rotor processing quality detection and assembly scenes.

A system may include a lateral shearing interferometer. The lateral shearing interferometer may enable measuring a surface profile of a sample, such as the pattern wafers, using reflected light from the sample. The reflected light may be reflected at a grazing incidence angle. A controller may receive images from the lateral shearing interferometer and measure the surface profile. The controller may measure the surface profile by reconstructing a phase of the reflected light from the images. The controller may reconstruct the phase using spatial reconstruction or time-domain reconstruction. The gratings may allow the controller to measure the edge roll-off in one or two dimensions. The controller may also calibrate the grazing incidence angle and determine refractive indices of thin-films on the sample. The controller may also perform full measurements of the surface profile using line beams, rectangular beams, or full-sample beams.

The invention discloses a large-depth-diameter-ratio inner hole coaxial precision measurement method and system based on five-system error coupling, belongs to the field of surface profile measurement, and solves the problem that a traditional cylindricity instrument cannot accurately measure the coaxiality of an inner hole of a cylindrical rotary body with a large depth-diameter ratio. The method comprises the following steps: acquiring error parameters in a measurement system, and calculating five system errors of a component, including an eccentric error, a sensor lateral offset error, a sensor pitching error, a sensor vertical guide rail error and an inclination error of the component; and according to the error, constructing a five-system error coaxiality measurement model, and carrying out coaxiality measurement on the to-be-measured component by adopting the five-system error coaxiality measurement model. The method is suitable for large-depth-diameter-ratio inner hole coaxiality measurement scenes.