An integrated
multiplex measurement
system for measuring
semiconductor objects includes a main body, a fringe interferometer, a
white light interferometer probe, and a color conjugate focal measurement probe. The fringe interferometer,
white light interferometer probe, and color conjugate focal measurement probe are housed within the main body. The fringe interferometer can be used to measure the warp, unevenness, color, brightness distribution, shape, and high-
nitrogen region distribution of the
semiconductor object. The
white light interferometer probe and color conjugate focal measurement probe are located at one point. The white light interferometer probe can measure the
surface roughness and
surface depth of the
semiconductor object, while the color conjugate focal measurement probe can measure the
surface roughness and thickness of the semiconductor object. It can accurately measure the
surface roughness of the semiconductor object using
confocal imaging dispersion analysis technology, and can also perform surface profile measurements, including fine curvature and structural features. This invention integrates multiple measuring devices into one
machine, which can be used separately or together, thus facilitating the measurement of semiconductor objects.