Silicon wafer cutting and cleaning mechanism for LED

Abstract

The invention discloses a silicon wafer cutting and cleaning mechanism for an LED. The silicon wafer cutting and cleaning mechanism comprises a conveying mechanism, a cutting structure and a cleaningmechanism, wherein the conveying mechanism comprises a supporting frame; the two ends of the supporting frame are rotatably connected to supporting rollers; a drive steel rope sleeves the outer ringsof the two supporting rollers; a mounting plate is connected on the drive steel rope; a silicon wafer is detachably mounted on the mounting plate; the cutting mechanism comprises a cutting room, the positions, at the two sides above a jacking plate, of the cutting room are rotatably connected to drive rollers; the outer rings of the drive rollers are provided with cutting lines; the cleaning mechanism comprises a cleaning room; the drive steel rope passes through the cleaning room; and silicon wafer cleanout liquid is set in the cleaning room. The silicon water is subjected to linear cutting through the cutting lines, so that cutting is convenient, and the cut silicon wafer is moved into the cleaning room through the drive steel rope; and the silicon wafer cleanout liquid in the cleaning room cleans the silicon wafer, so that cutting and cleaning integrated operation is achieved, and therefore, silicon wafer production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of LED lamp production, in particular to a silicon wafer cutting and cleaning mechanism for LEDs. Background technique [0002] Monocrystalline silicon is a relatively active non-metallic element. It is an important part of crystalline materials and is at the forefront of the development of new materials. Its main uses are as semiconductor materials and the use of solar photovoltaic power generation, heating, etc. It is used in the production and deep processing of monocrystalline products at the diode level, rectifier level, circuit level and solar cell level. When monocrystalline silicon is used for LEDs, it is necessary to cut the monocrystalline silicon into silicon wafers. Bye, the silicon wafers are cut into specified Small size, convenient for transfer and use. In the prior art, when cutting silicon wafers, it is necessary to install the silicon wafers under the cutting mechanism to fix them. It is ve...

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Problems solved by technology

[0002] Monocrystalline silicon is a relatively active non-metallic element. It is an important part of crystalline materials and is at the forefront of new material development. Its main uses are as semiconductor materials and solar photovoltaic power generation, heating, etc. Monocrystalline silicon can It is used for the production and deep processing of monocrystalline products at the diode level, rectifier level, circuit level and solar cell level. When monocrystalline silicon is used for LEDs, it is necessary to cut the monocrystalline silicon into silicon wafers. Bye, the silicon wafers are cut into specified Size, convenient for transfer and use. In the prior art, when cutting silicon wafers, it is necessary to install the silicon wafers under the cutting mechanism for fixing. It is very inconvenient to load materials during cutting, and the surface of the silicon wafers after cutting is polluted. , will cause the device to fail and cannot be used directly

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