Heat dissipation power device for power engineering

Abstract

The present invention discloses a heat dissipation power device for power engineering. The heat dissipation power device structurally comprises a heat dissipation base, water guide pipes and built-incopper blocks, the lower end face of the heat dissipation base is installed on the outer side faces of the upper ends of the built-in copper blocks in an attached mode, and the water guide pipes are evenly distributed on the left end faces and the right end faces of the built-in copper blocks; the heat dissipation base comprises heat dissipation mechanisms, a heat conduction coating, an embedded fixing block and an embedded groove. The heat dissipation mechanisms are symmetrically installed on the left and right sides of the upper end of the embedded groove. The heat conduction coating is uniformly smeared on the end surface of the lower side of the embedded fixing block and is attached to the embedded groove; the embedded groove is fixedly embedded in the lower end surface of the embeddedfixing block; and the embedded groove is located under the heat dissipation mechanisms. By means of the specific heat capacity of water, heat is evenly conducted into the connecting plates and the heat dissipation block body, the heat is transmitted into the second built-in copper block through the second water flowing pipe, finally, the high temperature of the water is dissipated through a hollowed-out block, and more heat dissipation space and heat dissipation effect are obtained by means of embedding fit of the multiple sets of connecting plates and the heat dissipation block.

Description

technical field [0001] The invention belongs to the field of electric power, and more specifically, relates to a cooling power device for power engineering. Background technique [0002] The heat dissipation power device used in electric power engineering is mainly assembled on the power hub. By embedding the copper sheet on the heat sink, the good thermal conductivity of the copper sheet is used to dissipate the heat through the heat sink, thereby achieving the effect of reducing the temperature. . [0003] Based on the above inventors' discovery, the existing methods mainly have the following disadvantages, for example: when the heat sink is dissipating heat through copper sheets, since the arrangement of copper sheets usually stacks multiple sheets together to dissipate heat through the lateral outer contour, As a result, the heat can only be dissipated through a small number of exposed surfaces, and a large part of the copper sheets in the combined copper sheet can only...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above-mentioned technology, when the heat sink dissipates heat through copper sheets, since the arrangement of copper sheets usually stacks multiple sheets together to dissipate heat through the lateral outer contour, the heat can only be dissipated through a small number of exposed surfaces, while A very large part of the copper sheet in the combined copper sheet can only play the role of heat conduction and cannot dissipate heat

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