Communication PCB backboard and lamination and buried copper plate laminating and arranging method

A backplane and communication technology, applied in multi-layer circuit manufacturing, electrical components, printed circuit components, etc., can solve problems such as glue flow that cannot be removed, achieve improvement that cannot be removed, eliminate thickness differences, and improve production efficiency and production quality Effect

Inactive Publication Date: 2020-11-06
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the existing technical defects, to provide a method of pressing and arranging communication PCB backplanes and buried copper plates, by using the combination of copper foil + release film as the covering material during pressing, to improve The problem that the adhesive flow after the abrasive belt cannot be removed improves the production efficiency and production quality

Method used

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Embodiment

[0023] A method of pressing and arranging a communication PCB backplane and buried copper boards shown in this embodiment includes the following processing steps in sequence:

[0024] (1) Cutting: cut out the core board and PP sheet according to the panel size 320mm×420mm, the thickness of the core board is 0.5mm, and the thickness of the outer copper surface of the core board is 0.5OZ.

[0025] (2), making the inner layer circuit (negative film process): on the core board, use a vertical coating machine to coat the photosensitive film, the film thickness of the photosensitive film is controlled at 8 μm, and a fully automatic exposure machine is used to expose the ruler with 5-6 grids (21 grid exposure ruler) to complete the exposure of the inner layer circuit; inner layer etching, etch the inner layer circuit on the core board after exposure and development, and measure the inner layer line width to 3mil; inner layer AOI, and then check the open and short circuit of the inner ...

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Abstract

The invention discloses a communication PCB backboard and buried copper plate laminating and arranging method, which comprises the following steps of: after cutting a core plate and a PP sheet, windowing at the positions, corresponding to buried copper blocks, on the core plate and the PP sheet; wherein the core plate and the PP sheet are sequentially laminated according to requirements to form alaminated plate, copper-buried slotted holes are formed in corresponding windows of the core plate and the PP sheet, then the copper-buried blocks are placed in the copper-buried slotted holes, and the thickness of the copper-buried blocks is larger than or equal to that of the laminated plate; and placing the laminated plate in a vacuum laminating machine to be laminated, and a copper foil and arelease film being sequentially laminated on each of the upper surface and the lower surface of the laminated plate from inside to outside in the laminating process. According to the invention, the combination of the copper foil and the release film is used as a coating material during pressing, so that the problem that gummosis cannot be removed after belt sanding is solved, and the production efficiency and the production quality are improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for press-fitting and arranging communication PCB backboards and buried copper boards. Background technique [0002] As the integration of electronic systems continues to increase, circuit boards are becoming more and more integrated and functional. At the same time, with the advent of the 5G era, the application of high-frequency and high-speed products is becoming more and more extensive; therefore, heat dissipation technology is used more and more in the PCB industry. Relatively speaking, based on the good heat dissipation performance of copper blocks, the use of Buried copper block (referred to as buried copper block or buried copper) is a good choice. [0003] The buried copper block process is to slot the PCB where the components or chips are installed, put the copper block in the slot when stacking the board, and then press it together wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/46H05K1/02
CPCH05K1/021H05K3/00H05K3/46H05K2201/10416
Inventor 樊锡超季辉涂圣考孙保玉
Owner SHENZHEN SUNTAK MULTILAYER PCB
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