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Optical assembly and optical module having same

A technology for optical components and optical modules, which is applied in the coupling of optical components, optics, and optical waveguides. , the effect of increasing the transmission bandwidth and reducing the loss

Pending Publication Date: 2020-11-10
INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In the prior art, bonding wires are usually used to achieve conduction and signal transmission in two links that need to be connected. However, bonding wires themselves are highly inductive, and mutual inductance exists between adjacent bonding wires. The impedance of the bonding wire is high, and the whole link has a sudden change point of impedance at the bonding wire, and the loss is large, which is not conducive to the development of higher-speed optical modules.

Method used

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  • Optical assembly and optical module having same
  • Optical assembly and optical module having same
  • Optical assembly and optical module having same

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Embodiment Construction

[0025] The application will be described in detail below in conjunction with specific implementations shown in the accompanying drawings. However, these implementations do not limit the present application, and any structural, method, or functional changes made by those skilled in the art based on these implementations are included in the protection scope of the present application.

[0026] In each drawing of the present application, some dimensions of structures or parts are exaggerated relative to other structures or parts for convenience of illustration, and therefore, are only used to illustrate the basic structure of the subject matter of the present application.

[0027] In addition, terms used herein such as "upper", "above", "under", "below", etc. to express relative positions in space are for convenience of description to describe a unit or feature as shown in the drawings relative to A relationship to another cell or feature. The terms of spatial relative position ...

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Abstract

The invention discloses an optical assembly and an optical module with the same. The optical assembly comprises signal lines, a ground plane and bonding lines; the signal lines comprise a first signalline and a second signal line which are distributed at intervals; the bonding lines comprise first bonding lines and at least one second bonding line which are arranged adjacently, wherein the firstbonding lines are connected with the first signal line and the second signal line, and the second bonding lines are connected with the ground plane. The second bonding lines are connected with the ground plane, and at least part of the second bonding lines are suspended above the signal lines in a covering mode. The second bonding lines are connected with the ground plane to form electromagnetic shielding, the second bonding lines pass through the signal line area provided with the first bonding lines, the electromagnetic shielding effect can be well radiated to the first bonding line area, the sensibility of the first bonding lines can be reduced, the impedance of the first bonding lines is reduced, efficient transmission of signals in the signal lines is facilitated, and the reliabilityof the signal lines is improved; the loss can be greatly reduced, the transmission bandwidth is improved, and the high-frequency design requirement is met.

Description

technical field [0001] The present application relates to the technical field of manufacturing optical communication components, in particular to an optical component and an optical module having the same. Background technique [0002] In the prior art, bonding wires are usually used to achieve conduction and signal transmission in two links that need to be connected. However, bonding wires themselves are highly inductive, and mutual inductance exists between adjacent bonding wires. As a result, the impedance of the bonding wire is high, and there is a sudden change in impedance at the bonding wire in the entire link, resulting in a large loss, which is not conducive to the development of higher-speed optical modules. Contents of the invention [0003] The present application discloses an optical component and an optical module thereof. The optical component includes a signal line, a ground plane, and a bonding wire. The signal line includes a first signal line and a secon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42H04B10/40H04B10/50
CPCG02B6/4277H04B10/40H04B10/501
Inventor 汪振中贾秀红
Owner INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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