Direct-scanning exposure device

Abstract

Provided is a practical direct-scanning exposure device capable of sufficiently vacuum-adsorbing substrates of various sizes to a table and exposing the substrates. A substrate (S) is placed on a table (2) on which a large number of vacuum adsorption holes (21) are formed, vacuum adsorption is performed, and when an optical table (2) of an exposure pattern is moved by a conveyance system (3) and passes through an exposure region, light of the exposure pattern is irradiated by an exposure unit (1) and exposed. A large number of vacuum adsorption holes (21) are formed corresponding to the substrate (S) of the maximum size, and a thin plate (71) blocks the vacuum adsorption holes (21) which are not blocked by the substrate (S). The thin plate (71) has suction holes (73) or openings (75, 76),and a thin plate mechanism (72) is positioned so as not to block vacuum suction of the substrate (S). The thin plate (71) and the thin plate mechanism (72) are attached to the table (2) and move integrally with the table (2).

Description

technical field [0001] The invention of the present application relates to a direct tracing type exposure apparatus for exposing a substrate by irradiating light in a predetermined pattern without passing through a mask. Hereinafter, the predetermined pattern of light at the time of exposure is called an exposure pattern. Background technique [0002] Exposure technology for exposing an object having a photosensitive layer formed on its surface to sensitize the photosensitive layer is widely used in the formation of various microcircuits and microstructures, etc. as a main technology of photolithography. A typical exposure technique is a technique in which an image of the mask is projected on the surface of an object by irradiating light to a mask formed with the same pattern as the exposure pattern, whereby the object is irradiated with light of the exposure pattern. [0003] In addition to such an exposure technique using a mask, there is also known a technique of directl...

AI Technical Summary

Problems solved by technology

However, in this configuration, the structure inside the table is complicated, and the structure of its vacuum exhaust is also complicated.

In addition, even if it can barely cope with two to three types of differences in substrate size, it will be too complicated and complicated for more than one difference, and the cost of the device will increase, so it cannot be called a practical device.

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