Semiconductor device

A technology for semiconductors and structural components, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc.

Pending Publication Date: 2020-11-10
MITSUBISHI ELECTRIC CORP
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the above problems become more serious

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0026] 1.1 Semiconductor device

[0027] figure 1 It is an exploded perspective view schematically illustrating the semiconductor device of Embodiment 1. FIG. figure 2 It is a cross-sectional view schematically illustrating the semiconductor device of the first embodiment.

[0028] figure 1 as well as figure 2 The illustrated semiconductor device 1 of Embodiment 1 is a power module.

[0029] The semiconductor device 1 may be a semiconductor device other than a power module.

[0030] The semiconductor device 1 has a structural component 101 and a plurality of structural components 110 . A plurality of structural components 110 are mounted and stacked on the structural component 101 .

[0031] The structural member 101 is a base substrate serving as a reference. The structural component 101 may also be a structural component other than the base substrate.

[0032] The plurality of structural components 110 has structural components 103 and structural components 105 . ...

Embodiment approach 2

[0064] Figure 4 It is an exploded perspective view schematically showing the semiconductor device of Embodiment 2. Figure 5 It is a cross-sectional view schematically illustrating a semiconductor device according to Embodiment 2.

[0065] Figure 4 as well as Figure 5 The illustrated semiconductor device 2 of Embodiment 2 and figure 1 as well as figure 2 The illustrated semiconductor device 1 of Embodiment 1 is mainly different in the following points. Regarding points not described below, the semiconductor device 2 of the second embodiment also has the same structure as that of the semiconductor device 1 of the first embodiment.

[0066] The plurality of structural components 110 includes a structural component 102 , a structural component 103 , a structural component 104 , and a structural component 105 .

[0067] The first structural member A1 has a structural member 101 . The second structural member A2 has two or more structural members 102 and 103 stacked. Th...

Embodiment approach 3

[0074] Figure 6 It is an exploded perspective view schematically illustrating the semiconductor device of Embodiment 3. Figure 7 It is a cross-sectional view schematically illustrating a semiconductor device according to Embodiment 3.

[0075] Figure 6 as well as Figure 7 The illustrated semiconductor device 3 of Embodiment 3 and figure 1 as well as figure 2 The illustrated semiconductor device 1 of Embodiment 1 is mainly different in the following points. Regarding points not described below, the semiconductor device 3 of the third embodiment also has the same structure as that of the semiconductor device 1 of the first embodiment. The semiconductor device 3 of the third embodiment can also be used with Figure 4 as well as Figure 5 The semiconductor device 2 of the illustrated second embodiment has the same structure as that adopted.

[0076] The semiconductor device 3 has a structural component 101 , a plurality of structural components 110P, and a plurality o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

Provided is a semiconductor device capable of mounting a plurality of stacked structural members on the structural members without creating a process recipe. The semiconductor device includes a structural member and a plurality of stacked structural members mounted on the structural member. The structural member and the plurality of structural members include a first structural member and a secondstructural member mounted on the first structural member. The first structural member has an identification mark indicating information relating to the second structural member.

Description

technical field [0001] The present invention relates to a semiconductor device. Background technique [0002] Semiconductor devices such as power modules often have a structure in which other structural components such as mounting components are mounted on structural components such as a base substrate. In the case of mounting other structural components on the structural components with a mounting machine for the purpose of manufacturing a specific type of semiconductor device, prior to mounting other structural components on the structural components, regarding the specific type of semiconductor device, for each structure mounted Create a recipe (recipe) that sets the type, mounting position, mounting angle, mounting condition, mounting order, etc. of each structural component for each mounting point of the component. The loading conditions include moving speed, loading speed, and the like. Crafting recipes are also known as programs. In addition, the mounting machine c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/544
CPCH01L23/544H05K13/04H01L23/3735H01L21/4882H01L23/13H01L2223/54433H01L2223/54413H01L2224/83385H01L2224/32225H01L25/50H01L25/071
Inventor 岩永広志
Owner MITSUBISHI ELECTRIC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap