Semiconductor package and lidar transmission unit

Abstract

The present invention relates to a semiconductor package and to a LIDAR transmitting unit comprising such a semiconductor package. The semiconductor package comprises a surface-emitting laser, at least one driver circuit for the surface-emitting laser, a connecting structure and at least one interposer. The connecting structure comprises a plurality of solder bumps. The surface-emitting laser is electrically connected to the at least one driver circuit via the at least one interposer and the connecting structure.

Description

technical field [0001] The present invention relates to a semiconductor package, more particularly to a semiconductor package comprising a surface emitting laser, at least one driver circuit for the surface emitting laser and at least one interposer, and a LIDAR emitting unit comprising such a semiconductor package. Background technique [0002] In laser array devices, such as LIDAR applications (Light Detection and Ranging, Light-Based Detection and Distance Measurement), surface-emitting lasers, so-called VCSELs (Vertical Cavity Surface-Emitting Lasers, surface-emitting lasers with vertical resonators) are often used ). These surface emitting lasers are arranged on a semiconductor package together with corresponding driver circuits. In this case, usually the electrical contact between the driver circuit and the surface emitting laser is made via bonding wires. [0003] In some applications, such as in the automotive field, such bonding wires have a distance (also called ...

AI Technical Summary

Problems solved by technology

In cases where at least the resolution of a surface-emitting laser is required, the minimum size of the laser is therefore predetermined, which leads to high costs for semiconductor manufacturing, since the semiconductor surface itself increases as well as the error rate for larger semiconductor components the next time products, resulting in higher cost

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