Temperature sensor, injection molding packaging mold and injection molding packaging method

A packaging method and injection molding technology, which is applied in the field of temperature sensors and injection packaging molds, can solve problems such as inconsistent glue filling and shell thermal conductivity, affecting product waterproof and temperature-sensing performance, and poor positioning of temperature-sensing elements, etc., to achieve consistency in appearance Good, reduce the hidden danger of water leakage, improve the effect of temperature sensing performance

Active Publication Date: 2021-03-02
帕艾斯电子技术(南京)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The packaging method used in the production process is to fill silicone or epoxy resin with a manual glue gun or a glue filling system. The thermal conductivity of the shell is inconsistent, which affects the waterproof and temperature sensing performance of the product

Method used

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  • Temperature sensor, injection molding packaging mold and injection molding packaging method
  • Temperature sensor, injection molding packaging mold and injection molding packaging method
  • Temperature sensor, injection molding packaging mold and injection molding packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Such as figure 1 , figure 2 As shown, the temperature sensor of the present invention includes a temperature sensing element 2, a cable 3 and a terminal 4; one end of the cable 3 is equipped with a terminal 4, and the cable 3 and the terminal 4 are connected by crimping tooling, and the other One end is installed with a temperature sensing element 2, and the temperature sensing element 2 and the cable 3 are connected by soldering; the cable 3 is at the end close to the temperature sensing element 2, and there is a cable 3a with a length L and the cable 3a. The temperature-sensing element 2 described above is encapsulated in the plastic casing 1 through injection molding; the plastic casing 1 is directly wrapped around the temperature-sensing element 2 and the periphery of the cable 3a, and the connection between the plastic casing 1 and the cable 3a seal between. The plastic shell 1 is molded by injection molding with thermoplastic material. The laser-engraved LOGO ...

Embodiment 2

[0072] Such as Figure 3-9 As shown, the injection molding packaging equipment of the present invention includes a turntable 9, a wire harness fixing seat 5-1, a primary injection mold 7, and a secondary injection mold 8; image 3 Among them, the primary injection mold 7 and the secondary injection mold 8 are all in the mold closing state.

[0073] The turntable 9, such as image 3 As shown, driven by a rotating drive mechanism (such as a motor, etc.), it can rotate around its own center. The turntable 9 is respectively provided with a primary injection molding station and a secondary injection molding station, so that the workpiece 6-1 to be injected and packaged (specifically, in the temperature sensor, is assembled from the terminal 4, the cable 3, and the temperature sensing element 2 components, at this time, the part of the temperature sensor that needs to be packaged is still in an unpackaged state) can first complete the injection molding package at the first injecti...

Embodiment 3

[0087] The difference between this embodiment and embodiment 2 is that the primary injection mold 7 and the secondary injection mold 8 with different structural forms are used. specifically:

[0088] Such as Figure 10-Figure 12 As shown, the primary injection mold 7 described in this embodiment includes a mold body, a plastic injection port 8-1b, and an external rubber delivery pipeline 7-5. The mold body is provided with a mold cavity a7-1, a mold cavity b, and a mold cavity a7-1 is a central cylindrical cavity structure, the inner diameter matches the outer diameter of the cable 3 of the temperature sensor, the mold cavity b is a semi-closed cylindrical cavity structure, and the closed end of the mold cavity b is provided with an outer convex part 7 at the middle position -4, the shape of the protruding part 7-4 matches the top arc surface of the temperature sensing element 2 of the temperature sensor. There are more than two external conveying pipes, and each external co...

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Abstract

The invention discloses a temperature sensor, an injection packaging mold and an injection packaging method. The injection molding packaging method is used for injection molding packaging of the part to be packaged of the sensor assembly, which adopts the method of step-by-step glue filling, directly injects glue to the part of the sensor component to be packaged, and finally forms a plastic shell that can directly wrap the part to be packaged, Thus, the packaging of the sensor component is completed. The injection molding packaging mold described in the present invention is used to realize the above injection molding packaging method. The temperature sensor of the present invention forms a plastic shell through the above-mentioned injection molding packaging method, so as to directly wrap the temperature sensing element, the connection point between the temperature sensing element and the cable a, and the periphery of the cable a. It can be seen that the present invention has good appearance consistency, reduces cost, reduces hidden dangers of water leakage, improves temperature-sensing performance, and reduces damage to temperature-sensing elements due to misoperation in assembly and glue filling processes.

Description

technical field [0001] The invention relates to a temperature sensor. [0002] The invention relates to an injection packaging mold, which is used for injection molding the outer casing of the temperature sensing element of a temperature sensor. [0003] The invention also relates to an injection molding encapsulation process, which is used to injection mold the outer casing of the temperature sensing element of the temperature sensor. Background technique [0004] At present, most temperature sensor products use a plastic case to wrap the temperature-sensing element, and then use glue filling to seal and protect the temperature-sensing element. The packaging method used in the production process is to fill silicone or epoxy resin with a manual glue gun or glue filling system, equalize, cool and form, which requires high proficiency, long debugging and assembly processes; The thermal conductivity of the shell is inconsistent, which affects the waterproof and temperature se...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/14B29C45/00B29C45/26B29B11/04G01K13/00B29L31/34
CPCB29C45/0055B29C45/14065B29C45/2602B29C45/261B29L2031/34G01K13/00
Inventor 严峻包英葛李春风张健赵强
Owner 帕艾斯电子技术(南京)有限公司
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