Curable composition, sealing agent for liquid crystals, liquid-crystal panel, and method for producing liquid-crystal panel
A curable composition and compound technology, which is applied in chemical instruments and methods, nonlinear optics, and other chemical processes, can solve problems such as liquid crystal sealant pollution, and achieve the effects of inhibiting orientation disorder, excellent cleaning performance, and orientation disorder suppression Effect
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Embodiment 1
[0195] Add 100 parts by mass of the following compound A as a curable compound, add 2 parts by mass of the following compound B as a photoinitiating compound in the photoinitiator, add 2 parts by mass of the following compound C as a visible light photosensitive compound, and add 2 parts by mass of the following compound C as a photoinitiator. Add 0.15 parts by mass of dibutyl hydroxytoluene (BHT) to the polymerization agent, add 10 parts by mass of silica (KE-C50HG manufactured by Nippon Shokubai Co., Ltd.) as an inorganic filler, add 15 parts by mass of resin filler as an organic filler ( F-351, manufactured by Aika Kogyo Co., Ltd.), 1 part by mass of a thixotropic agent (amorphous silica, TG-308F, manufactured by Cabot Japan Co., Ltd.), 10 parts by mass of EH-5001P (melting point: 100-120°C, manufactured by ADEKA Co., Ltd.), which is an adduct of amine compounds with a urea structure, was fully ground using a three-roll mill (C-43 / 4×10, manufactured by Inoue Seisakusho Co., ...
Embodiment 2
[0203] In the same manner as in Example 1, except that EH-5001P in Example 1 was changed to EH-4370S (adduct of an amine compound having a urea structure, melting point: 110 to 130°C, manufactured by ADEKA Corporation) The curable composition of Example 2 was obtained.
Embodiment 3、4
[0205] And the curable composition of embodiment 3, 4 is by changing the amount of thermosetting agent in embodiment 1, 2, makes the active hydrogen of thermosetting agent relative to the epoxy group of 1 equivalent curable compound be 1 equivalent And get. That is, except that the amounts of EH-5001P or EH-4370S in Examples 1 and 2 were changed as shown in Table 1, the curable compositions of Examples 3 and 4 were obtained in the same manner as in Examples 1 and 2. .
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