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Chemical mechanical polishing equipment and application method

A technology of chemical machinery and equipment, which is applied in the field of chemical mechanical polishing equipment, can solve the problems of changing the ejection amount of polishing liquid and low polishing efficiency, and achieve the effects of improving practicability, improving polishing efficiency, and increasing ejection amount

Inactive Publication Date: 2020-11-17
NANJING LINGQUE INTELLIGENT MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem of low polishing efficiency in the prior art that the polishing liquid cannot automatically change the ejection amount with the rotation speed of the mechanical parts, and proposes a chemical mechanical polishing equipment and using method

Method used

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  • Chemical mechanical polishing equipment and application method
  • Chemical mechanical polishing equipment and application method
  • Chemical mechanical polishing equipment and application method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] refer to Figure 1-4 , a kind of chemical mechanical polishing equipment, comprising a first box body 1, a support cover 101 and a part body 704, a moving mechanism is provided on the support cover 101, a lifting mechanism is provided at the bottom of the moving mechanism, and a second motor 401 is arranged in the lifting mechanism, The output end of the second motor 401 is provided with a polishing disc 402 that cooperates with the part body 704. The side wall of the support cover 101 is rotatably connected with a first rotating shaft 502, and the end of the first rotating shaft 502 away from the support cover 101 is fixedly connected with a second support plate. 6. The side wall of the support cover 101 is also fixedly connected with the second cylinder 7, the output end of the second cylinder 7 is connected with the third support plate 701, the third support plate 701 is rotatably connected with the rotation plate 702, and the part body 704 is fixed on the rotation B...

Embodiment 2

[0041] refer to Figure 1-4 , a kind of chemical mechanical polishing equipment, comprising a first box body 1, a support cover 101 and a part body 704, a moving mechanism is provided on the support cover 101, a lifting mechanism is provided at the bottom of the moving mechanism, and a second motor 401 is arranged in the lifting mechanism, The output end of the second motor 401 is provided with a polishing disc 402 that cooperates with the part body 704. The side wall of the support cover 101 is rotatably connected with a first rotating shaft 502, and the end of the first rotating shaft 502 away from the support cover 101 is fixedly connected with a second support plate. 6. The side wall of the support cover 101 is also fixedly connected with the second cylinder 7, the output end of the second cylinder 7 is connected with the third support plate 701, the third support plate 701 is rotatably connected with the rotation plate 702, and the part body 704 is fixed on the rotation B...

Embodiment 3

[0052] A method for using chemical mechanical polishing equipment, the following steps are used:

[0053] S1, start the second cylinder 7, and fix the part body 704;

[0054] S2, start the first motor 2, the first motor 2 drives the threaded rod 202 to rotate, the threaded rod 202 drives the component body 704 to rotate, and at the same time, the first rotating shaft 502 drives the second rotating shaft 9 to rotate;

[0055] S3, the second rotating shaft 9 drives the piston plate 1201 to reciprocate through the cam 10, compressing the air in the piston barrel 1204 into the second hollow tube 13, so that the polishing solution in the second hollow tube 13 is sprayed from the nozzle 1302;

[0056] S4, start the first cylinder 302 and the second motor 401, make the polishing disc 402 contact with the part body 704, and polish the part body 704.

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Abstract

The invention discloses chemical mechanical polishing equipment and an application method, and belongs to the technical field of mechanical polishing. The chemical mechanical polishing equipment comprises a first box body, a supporting cover and a part body, wherein a moving mechanism is arranged on the supporting cover; a lifting mechanism is arranged at the bottom of the moving mechanism; a second motor is arranged in the lifting mechanism; a polishing disc matched with the part body is arranged at the output end of the second motor; a first rotating shaft is rotatably connected to the sidewall of the supporting cover; a second supporting plate is fixedly connected to one end, away from the supporting cover, of the first rotating shaft; and a second air cylinder is further fixedly connected to the side wall of the supporting cover. The chemical mechanical polishing equipment is simple in structure and easy to operate; through mutual cooperation of a cam and a piston plate, the polishing efficiency is improved, meanwhile, the spraying amount of the polishing solution is automatically changed along with the rotating speed of mechanical parts, and the practicability is greatly improved.

Description

technical field [0001] The invention relates to the technical field of mechanical polishing, in particular to chemical mechanical polishing equipment and a method for using it. Background technique [0002] After the mechanical parts are processed by the machine tool, especially the shaft parts of some rotary bodies, in order to meet the design requirements, they need to be polished. Polishing refers to the use of mechanical, chemical or electrochemical effects to reduce the surface roughness of the workpiece, so as to The processing method to obtain a bright and flat surface is to use polishing tools and abrasive particles or other polishing media to modify the surface of the workpiece. Polishing cannot improve the dimensional accuracy or geometric shape accuracy of the workpiece, but to obtain a smooth surface or specular luster. The purpose is sometimes used to eliminate gloss. However, the current polishing equipment has low polishing efficiency when it is working. When ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00B24B37/11B24B37/27B24B37/34B24B47/12B24B47/22B24B57/02
CPCB24B37/00B24B37/11B24B37/27B24B37/34B24B47/12B24B47/22B24B57/02
Inventor 李伟伟陈蕾
Owner NANJING LINGQUE INTELLIGENT MFG CO LTD
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