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Semiconductor device

A semiconductor and device technology, applied in the field of semiconductor devices, can solve problems such as complex structure of semiconductor devices

Pending Publication Date: 2020-11-17
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to meet these demands, semiconductor devices have been highly integrated, and the structure of semiconductor devices has become increasingly complex

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

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Embodiment Construction

[0017] figure 1 is a plan view illustrating a semiconductor device according to some example embodiments of the inventive concepts. Figure 2A , Figure 2B and Figure 2C are along figure 1 Cross-sectional views taken along lines I-I', II-II' and III-III'. image 3 is based on Figure 2A Depth in a semiconductor layer schematically shows a graph of dopant concentration.

[0018] refer to figure 1 and Figure 2A to Figure 2C , a semiconductor layer SL may be provided. The semiconductor layer SL may have a first surface SLa and a second surface SLb opposite to the first surface SLa. The semiconductor layer SL may include a first active region PR and a second active region NR. For example, the semiconductor layer SL may include silicon, germanium, or a combination thereof.

[0019] A device isolation layer ST may be provided on the first surface SLa of the semiconductor layer SL. The device isolation layer ST may define a first active region PR and / or a second active r...

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Abstract

The invention provides a semiconductor device. The semiconductor device includes a semiconductor layer having a first surface and a second surface opposite to the first surface, an active pattern on the first surface, the active pattern including a source / drain region, a power rail electrically connected to the source / drain region, and a power delivery network on the second surface, the power delivery network electrically connected to the power rail. The semiconductor layer includes an etch stop dopant that has a maximum concentration at the second surface.

Description

[0001] Cross References to Related Applications [0002] This patent application claims priority from Korean Patent Application No. 10-2019-0057543 filed with the Korean Intellectual Property Office on May 16, 2019, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0003] Example embodiments of inventive concepts relate to semiconductor devices, and more particularly, to semiconductor devices including field effect transistors and methods of manufacturing the same. Background technique [0004] Semiconductor devices are widely used in the electronics industry due to their small size, multifunctional properties, and / or low manufacturing costs. Semiconductor devices may be classified as any of semiconductor memory devices that store logical data, semiconductor logic devices that process logical data, and hybrid semiconductor devices that have both the functions of a semiconductor memory device and the functions of a semiconductor lo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L23/538H01L29/06H01L27/088
CPCH01L27/088H01L29/0684H01L23/49827H01L23/5386H01L23/481H01L23/535H01L23/5286H01L23/485H01L21/76898H01L21/76895H01L21/76897H01L29/7848H01L29/7846H01L21/76829H01L21/76877H01L23/5226H01L23/50
Inventor 佐佐木雄一朗林圣根姜泌圭金元洪吴承河河龙湖玄尚镇
Owner SAMSUNG ELECTRONICS CO LTD