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Backlight module

A technology of backlight module and light-emitting chip, which is applied in optics, electric light source, nonlinear optics, etc., can solve the problem of narrow application range of quantum dot film 100, high production cost of quantum dot film 100, and large amount of quantum dot 111, etc. problem, to achieve the effect of improving color consistency, increasing the scope of application, and increasing the color consistency of light

Active Publication Date: 2020-11-24
FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to the existence of the transparent adhesive layer, the thickness of the existing backlight module is relatively thick, and the application range is relatively limited
[0005] In addition, the existing quantum dot film 100 is made up of quantum dots 111 coated based on the transparent protective material 112; Can cause partial quantum dot 111 to fail, the scope of application of quantum dot film 100 is narrower;

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0036] figure 2 A schematic structural diagram of a backlight module according to an embodiment of the present invention is shown, Figure 5 A schematic structural diagram of the first color conversion composite film 200 according to an embodiment of the present invention is shown.

[0037] The backlight module of the embodiment of the present invention includes a substrate 101, a light-emitting chip 102, and a first color conversion composite film 200; several light-emitting chips 102 are arrayed on the substrate 101, and the first color conversion composite film 200 covers the several light-emitting chips 102. on the chip 102 surface.

[0038] The first color conversion composite film 200 includes a first transparent protective material 202 and a plurality of pieces of first color conversion film 201 dispersedly coated with the first transparent protective material 202; each of the plurality of light-emitting chips 102 emits light Chip 102 is correspondingly provided with...

Embodiment 2

[0056] Figure 6 A schematic structural diagram of a backlight module according to an embodiment of the present invention is shown.

[0057] On the basis of the structure of the backlight module in Embodiment 1, the second color conversion composite film 300 of the embodiment of the present invention includes several second color conversion films 301 coated with a second transparent protective material 302; the second color conversion film 301 At the same time, it surrounds the top surface and the side surface of the corresponding light-emitting chip 102 . Optionally, the second transparent protection material 302 is the same as the first transparent protection material 202 in the first embodiment, and the material of the second color conversion film 301 is the same as that of the first color conversion film 201 in the first embodiment. Compared with the existing color conversion composite film, the thickness of the color conversion film that the side light with weak light in...

Embodiment 3

[0062] Figure 7 A schematic structural diagram of a backlight module according to an embodiment of the present invention is shown. The backlight module of the embodiment of the present invention includes a substrate 101, a light-emitting chip 102, and a third color conversion composite film 400; several light-emitting chips 102 are arrayed on the substrate 101, and the third color conversion composite film 400 covers the several light-emitting chips 102. on the chip 102 surface.

[0063] The third color conversion composite film 400 of the embodiment of the present invention includes a third transparent protective material 402 , several third color conversion films 401 and a diffusion layer 403 coated based on the third transparent protective material. On the basis of the first embodiment, the diffusion layer 403 of the embodiment of the present invention is arranged under several third color conversion films 401, and the relationship between the diffusion layer 403 and the ...

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Abstract

The invention provides a backlight module. The backlight module comprises a substrate, a plurality of light-emitting chips and a color conversion composite film, wherein the light-emitting chips are arranged on the substrate in an array mode, and the color conversion composite film covers the surfaces of the light-emitting chips. The color conversion composite film comprises a transparent protective material and a plurality of color conversion films which are coated by the transparent protective material and are dispersedly arranged, each light-emitting chip in the plurality of light-emittingchips is correspondingly provided with a color conversion film, and each color conversion film is arranged on the top surface of the corresponding light-emitting chip. According to the backlight module, the color conversion film and the light-emitting chip are correspondingly arranged, the light-emitting consistency is good, the manufacturing cost is low, and good practicability is achieved.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a backlight module. Background technique [0002] In the existing backlight module, the blue light of the light-emitting chip is usually diffused through a diffusion plate, and then the blue light is converted into white light through a quantum dot film to obtain the required white backlight. [0003] figure 1 It shows a schematic structural diagram of an existing backlight module. In the existing backlight module, several light-emitting chips 102 are arrayed on a substrate 101, and the substrate 101 is covered with a layer of transparent adhesive layer 104 with a flat top surface. The adhesive layer 104 covers the plurality of light-emitting chips 102; the diffuser plate 105 is attached and arranged on the top of the transparent adhesive layer 104, and is used to disperse the blue light emitted by the light-emitting chips 102 to form a surface light source with a relatively uniform light in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13357H01L25/075F21S8/00F21V9/32
CPCG02F1/133602H01L25/0753F21S8/00F21V9/32
Inventor 赵强蒋纯干李凯利范凯亮谢宗贤覃玉璋刘传标
Owner FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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