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Label and package

A technology for packaging and labeling, which is applied in the field of labeling and packaging, and can solve problems such as uneven surfaces, easy occurrence of air bubbles, and inability to strengthen the stiffness of cups

Inactive Publication Date: 2020-11-24
INNER MONGOLIA YILI INDUSTRIAL GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such a design cannot enhance the stiffness of the current cup, and air bubbles are prone to appear after the label is pasted, and the surface is uneven

Method used

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Embodiment Construction

[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as any limitation of the invention, its application or uses. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0044] figure 1 A schematic structural view showing a cross-section of the label of this embodiment, figure 2 A schematic structural view of the adhesive layer of the label of this embodiment is shown.

[0045] combine figure 1 with figure 2 As shown, the label of this embodiment inclu...

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Abstract

The invention relates to a label and a package. The label comprises a substrate (1) and an adhesive layer (2) arranged on the first surface of the substrate (1); the adhesive layer (2) comprises a first adhesive part (21) which is arranged at the transverse first end of the substrate (1) and is used for connecting the transverse second end of the substrate (1), and a second adhesive part (22) which extends from the transverse first end of the substrate (1) to the transverse second end; the amount of glue applied per unit area of the second adhesive part (22) is smaller than the amount of glueapplied per unit area of the first adhesive part (21). According to the technical scheme, the gluing amount of the second gluing part (22) in the unit area is smaller than that of the first gluing part (21) in the unit area, and therefore the stiffness of a labeled object and the bonding firmness degree of the labeled object can be improved on the premise that the low gluing amount is guaranteed.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a label and a package. Background technique [0002] In the related technology, the yogurt cup is formed by online heating of polystyrene sheet, and then the hot melt adhesive on the label is melted rapidly by the waste heat of the formed cup, and then the label is pasted on the cup, and the label wraps around the cup for a week. The role of the label is mainly to display product information and beautify the packaging. In addition, the label can also enhance the stiffness of the polystyrene cup. At present, the thickness of the sheet for making the cup is 0.8 to 1.0mm. The wall thickness of the cup is poor in strength. After pasting the label, it can increase the stiffness of the cup and protect the cup from breaking. [0003] The label includes a paper base, a printing layer disposed on a first surface of the base, and an adhesive layer coated on a second surface of the base....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F3/02G09F3/10
CPCG09F3/02G09F3/10G09F2003/0248
Inventor 黄丽雪
Owner INNER MONGOLIA YILI INDUSTRIAL GROUP CO LTD
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