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Thermoelectric heating/cooling device including resistive heater

一种冷却装置、电阻加热元件的技术，应用在美国公报No.2011/0132000,温度控制领域，能够解决热电部件可靠性下降等问题，达到改善可靠性、增加装置寿命的效果

Active Publication Date: 2020-11-27
LAIRD THERMAL MANAGEMENT SYST INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using thermoelectric components heated to high temperature and / or kept at high temperature for a long time, the reliability of such thermoelectric components may decrease

Method used

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  • Thermoelectric heating/cooling device including resistive heater
  • Thermoelectric heating/cooling device including resistive heater
  • Thermoelectric heating/cooling device including resistive heater

Examples

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Embodiment Construction

[0034] The inventive concept will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the inventive concept are shown. However, inventive concepts may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. In the drawings, the size and relative sizes of elements, layers and regions may be exaggerated for clarity. Like reference numerals refer to like elements throughout.

[0035] figure 2 is included Figure 1A the bottom header of the Figure 1B and Figure 1C the top header and the Figure 1A and Figure 1C A cross-sectional view of a thermoelectric heating / cooling component or TEC (also known as a thermoelectric module) of thermoelectric (TE) elements P and N shown in . Figure 1D y...

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PUM

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Abstract

The invention discloses a thermoelectric heating / cooling device. The thermoelectric heating / cooling device can comprise a first thermally conductive header and a second thermally conductive header, wherein a plurality of thermoelectric elements can be coupled in parallel between the first thermally conductive header and the second thermally conductive header. Additionally, a resistive heating element can be disposed on the second header, and the second header can be located between the resistive heating element and the plurality of thermoelectric elements.

Description

[0001] This application is a branch of a Chinese patent application with the application number 201480080715.0 (international application number PCT / US2014 / 039376), the application date is May 23, 2014, and the invention title is "thermoelectric heating / cooling device including a resistance heater". case application. Background technique [0002] Embodiments of the inventive concepts relate to temperature control, and more particularly, to thermoelectric temperature control devices, methods, modules and components. [0003] can use such as p-Bi x Sb 2-x Te 3 and n-Bi 2 Te 3-x Se x Thermoelectric materials such as Peltier to provide heat pumping (eg, cooling and / or heating) and / or power generation according to the Peltier effect. For example, in Venkatasubramanian et al. titled "Phonon-Blocking Electron-Transmitting Structures" (18 th Thermoelectric materials and structures are discussed in the document International Conference On Thermoelectrics, 1999), the entire disc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02
CPCF25B2321/0212F25B2321/023F25B21/02H10N10/13H10N10/17H10N10/817B01L7/52B01L2300/1827F25B2400/01
Inventor P·克罗科R·马哈德万P·A·迪恩
Owner LAIRD THERMAL MANAGEMENT SYST INC
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