Automatic pin cutting and testing all-in-one machine for semiconductor electronic device and application thereof

Abstract

The invention provides an automatic pin cutting and testing all-in-one machine for a semiconductor electronic device and application thereof. The all-in-one machine comprises a main machine frame, andan automatic feeding bin, a turnover mechanism, a discharging straight rail mechanism, a pin cutting mechanism, a testing mechanism, a material distributing mechanism and a classifying box that are arranged on the main machine frame, wherein the automatic feeding bin can sense whether products exist in the bin or not and push out the products under the condition that the products exist in the binor not; the overturning mechanism can move the pushed-out products to the discharging straight rail mechanism; an axial sliding groove and an acceleration air blowing hole are formed in a straight rail of the discharging straight rail mechanism. The pin cutting mechanism can cut pins of products; the testing mechanism is located at the downstream of the pin cutting mechanism and can test and judge the product; the material distribution mechanism can put the products into different sub-boxes of the classification box according to a test judgment result. The applications include applications insemiconductor electronic device pin cutting and / or testing. Via the automatic pin cutting and testing all-in-one machine, the production cost can be remarkably reduced, and the production efficiencyand the production quality are improved; the pin cutting precision can reach + / -0.1 mm, and the precision is high.

Description

technical field [0001] The invention relates to the processing field of semiconductor electronic devices, in particular to an integrated machine for automatic cutting and testing of semiconductor electronic devices and its application. Background technique [0002] The existing manual cutting machine for semiconductor electronic devices can only produce about 1,000 products in one hour, and it has to go through multiple links such as cutting, selecting, manual pipe threading, manual selection, and then DC conventional parameter testing. Operation, there are problems such as low efficiency and low cutting accuracy. For example, the error is often about 0.5mm, and the length of the product pins cannot be consistent, and there will be different lengths. However, customers require that the product pin length is usually controlled within 0.2mm, which is difficult to meet customer requirements. In addition, in the existing process, after manually cutting the feet, it is necessary...

AI Technical Summary

Problems solved by technology

[0002] The existing manual cutting machine for semiconductor electronic devices can only produce about 1,000 products in one hour, and it has to go through multiple steps such as cutting, selection, manual pipe insertion, manual selection, and DC routine parameter testing. Due to the need for manual Operation, there are problems such as low efficiency and low cutting accuracy. For example, the error is often around 0.5mm, and the length of product pins cannot be consistent, and there will be situations of different lengths.

However, customers require that the pin length of the product is usually controlled within 0.2mm, which is difficult to meet customer requirements.

In addition, in the existing process, after manually cutting the feet, it is necessary to manually thread the pipe and then test the DC conventional parameters, which makes the production operation very inconvenient and costly, and the product quality cannot be effectively guaranteed. If the protection is not done well, it is easy to cause soft failure of the product, resulting in hidden dangers in quality

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