Semiconductor electronic device automatic cutting foot test all-in-one machine and its application

Abstract

The invention provides an integrated machine for automatic cutting and testing of semiconductor electronic devices and its application. The all-in-one machine includes a main body frame, and an automatic feeding bin, a turning mechanism, a feeding straight rail mechanism, a foot cutting mechanism, a testing mechanism, a material distribution mechanism and a sorting box arranged on the main body frame, wherein the automatic feeding The bin can sense whether there is a product in the bin, and push out the product if there is any; the turning mechanism can move the pushed out product to the straight rail mechanism for discharging; the straight rail of the straight rail mechanism for discharging is equipped with an axial chute and an acceleration blow hole The cutting mechanism can cut the product; the testing mechanism is located downstream of the cutting mechanism and can test and judge the product; the material distributing mechanism can put the product into different sub-boxes of the classification box according to the test and judgment results. Said applications include applications in cutting and / or testing of semiconductor electronic devices. The invention can significantly reduce the production cost, improve the production efficiency and production quality; the cutting precision can reach ±0.1mm, and the precision is high.

Description

technical field [0001] The invention relates to the field of processing of semiconductor electronic devices, in particular to an automatic cutting and testing all-in-one machine for semiconductor electronic devices and its application. Background technique [0002] The existing manual cutting machine for semiconductor electronic devices can only produce about 1,000 products in one hour, and it has to go through multiple steps such as cutting, selection, manual tube insertion, manual selection, and DC routine parameter testing. Due to the need for manual Operation, there are problems such as low efficiency and low cutting accuracy. For example, the error is often about 0.5mm, and the length of product pins cannot be consistent, and there will be situations of different lengths. However, customers require that the pin length of the product is usually controlled within 0.2mm, which is difficult to meet the customer's requirements. In addition, in the existing process, after ma...

AI Technical Summary

Problems solved by technology

[0002] The existing manual cutting machine for semiconductor electronic devices can only produce about 1,000 products in one hour, and it has to go through multiple steps such as cutting, selection, manual pipe insertion, manual selection, and DC routine parameter testing. Due to the need for manual Operation, there are problems such as low efficiency and low cutting accuracy. For example, the error is often around 0.5mm, and the length of product pins cannot be consistent, and there will be situations of different lengths.

However, customers require that the pin length of the product is usually controlled within 0.2mm, which is difficult to meet customer requirements.

In addition, in the existing process, after manually cutting the feet, it is necessary to manually thread the pipe and then test the DC conventional parameters, which makes the production operation very inconvenient and costly, and the product quality cannot be effectively guaranteed. If the protection is not done well, it is easy to cause soft failure of the product, resulting in hidden dangers in quality

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