Reliability analysis method of SiP micro system

An analysis method and micro-system technology, applied in the field of semiconductor reliability analysis, can solve the problems of poor pertinence and insufficient comprehensiveness of SiP micro-system module reliability analysis, and achieve the effect of high computing efficiency and improving reliability analysis efficiency.
CN112016227APending Publication Date: 2020-12-01北京轩宇空间科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
北京轩宇空间科技有限公司
Publication Date
2020-12-01

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Abstract

The invention discloses a high-reliability SiP reliability analysis method and process, and belongs to the field of semiconductor reliability analysis. The reliability analysis method comprises the following steps: establishing a finite element analysis model according to a design rule; establishing a material library, and endowing each part with material attributes; meshing and contact setting are carried out; establishing a simulation link, setting reasonable boundary conditions, applying a test load, solving and calculating according to the first evaluation test condition, and analyzing a result according to a failure criterion; building a simulation link, sequentially carrying out simulation calculation on all evaluation test items, and analyzing a result according to a failure criterion; weak links are found according to analysis results, and guidance suggestions are provided for design improvement and device application. Aiming at a high-reliability SiP micro system, a simulationlink is established to realize transverse linkage of multiple working conditions, the comprehensiveness and systematicness of reliability analysis of the SIP module are enhanced, and finally, a reliability analysis result acts on design improvement and application guidance.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor reliability analysis, in particular to a reliability analysis method of a SiP microsystem. Background technique

[0002] System-in-Package (SiP, System in Package) technology is an integrated packaging form that mixes and loads components with different functions into the same package through different technologies, thereby providing system-level or subsystem-level functions. As a technical route to continue Moore's Law at the system level, SiP is an important means to meet the integration and miniaturization of aerospace electronic products.

[0003] High reliability is the guarantee for the stable operation and function of semiconductor devices. Aerospace and military devices must experience harsh mechanical environments during their work. Therefore, reliability analysis must be used to ensure high structural reliability when designing packages and tubes. Reliability analysis is an import...

Claims

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