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Reliability analysis method of SiP micro system

An analysis method and micro-system technology, applied in the field of semiconductor reliability analysis, can solve the problems of poor pertinence and insufficient comprehensiveness of SiP micro-system module reliability analysis, and achieve the effect of high computing efficiency and improving reliability analysis efficiency.

Pending Publication Date: 2020-12-01
北京轩宇空间科技有限公司
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Problems solved by technology

[0006] In view of the lack of comprehensiveness and poor pertinence of reliability analysis of SiP microsystem modules in the prior art, the present invention provides a reliability analysis method for SiP microsystems, especially for highly reliable SiP microsystems, to enhance the reliability of SiP microsystem modules. The comprehensiveness and systematicness of reliability analysis, and finally let the results of reliability analysis act on design improvement and application guidance, fully reflecting the engineering significance of reliability analysis

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  • Reliability analysis method of SiP micro system
  • Reliability analysis method of SiP micro system
  • Reliability analysis method of SiP micro system

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Embodiment Construction

[0047] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, but the embodiments described in the present invention are some of the embodiments of the present invention, not all of them .

[0048] Such as figure 1 As shown, the reliability analysis method of SiP microsystem includes the following steps:

[0049] S11. Establishing a finite element analysis model according to design rules;

[0050] S12. Establish a material library and assign material properties to each component;

[0051] S13. Carry out mesh division and contact setting;

[0052] S14. According to the first assessment test condition, build a simulation link, set reasonable boundary conditions, apply test loads, solve calculations, and analyze the results according to failure criteria;

[0053] S15 and S16 build a simulation ...

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Abstract

The invention discloses a high-reliability SiP reliability analysis method and process, and belongs to the field of semiconductor reliability analysis. The reliability analysis method comprises the following steps: establishing a finite element analysis model according to a design rule; establishing a material library, and endowing each part with material attributes; meshing and contact setting are carried out; establishing a simulation link, setting reasonable boundary conditions, applying a test load, solving and calculating according to the first evaluation test condition, and analyzing a result according to a failure criterion; building a simulation link, sequentially carrying out simulation calculation on all evaluation test items, and analyzing a result according to a failure criterion; weak links are found according to analysis results, and guidance suggestions are provided for design improvement and device application. Aiming at a high-reliability SiP micro system, a simulationlink is established to realize transverse linkage of multiple working conditions, the comprehensiveness and systematicness of reliability analysis of the SIP module are enhanced, and finally, a reliability analysis result acts on design improvement and application guidance.

Description

technical field [0001] The invention relates to the technical field of semiconductor reliability analysis, in particular to a reliability analysis method of a SiP microsystem. Background technique [0002] System-in-Package (SiP, System in Package) technology is an integrated packaging form that mixes and loads components with different functions into the same package through different technologies, thereby providing system-level or subsystem-level functions. As a technical route to continue Moore's Law at the system level, SiP is an important means to meet the integration and miniaturization of aerospace electronic products. [0003] High reliability is the guarantee for the stable operation and function of semiconductor devices. Aerospace and military devices must experience harsh mechanical environments during their work. Therefore, reliability analysis must be used to ensure high structural reliability when designing packages and tubes. Reliability analysis is an import...

Claims

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Application Information

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IPC IPC(8): G06F30/23G06T17/00G06F119/02
CPCG06F30/23G06T17/00G06F2119/02
Inventor 李亚妮刘鸿瑾刘群张建锋
Owner 北京轩宇空间科技有限公司
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