The invention discloses a high-reliability SiP reliability
analysis method and process, and belongs to the field of
semiconductor reliability analysis. The reliability
analysis method comprises the following steps: establishing a finite
element analysis model according to a design rule; establishing a material
library, and endowing each part with material attributes; meshing and contact setting are carried out; establishing a
simulation link, setting reasonable boundary conditions, applying a test load, solving and calculating according to the first evaluation test condition, and analyzing a result according to a failure criterion; building a
simulation link, sequentially carrying out
simulation calculation on all evaluation test items, and analyzing a result according to a failure criterion; weak links are found according to analysis results, and guidance suggestions are provided for
design improvement and device application. Aiming at a high-reliability SiP micro
system, a simulationlink is established to realize transverse linkage of multiple working conditions, the comprehensiveness and systematicness of reliability analysis of the SIP module are enhanced, and finally, a reliability analysis result acts on
design improvement and application guidance.