PI protective film uncovering method of rigid-flex printed circuit board

Abstract

The invention relates to a PI protective film uncovering method of a rigid-flex printed circuit board, which is suitable for uncovering more than 6 layers of rigid-flex printed circuit boards, and comprises the following steps of manufacturing PP by using a high-gummosis prepreg, burning out a slot with a certain slot width by using a UV laser machine to perform PP windowing, enabling the PP windowing to be located at two sides of the rigid-flex boundary and dividing the rigid-flex boundary into two parts, when the copper layer corresponding to the PP is used for manufacturing a circuit, completely etching off the copper sheet corresponding to the area 0.4 mm away from the inner edge of the PP, attaching a PI protective film to the bottom of the PP on the bottommost layer, enabling the PIprotective film to be located in the flexible board area and be 0.25 mm away from the rigid-flex boundary, sequentially stacking and pressing the PI protective film, at least one layer of PP and a layer of copper foil on the flexible board to which a covering film is attached, conducting outer layer manufacturing, and in the outer layer manufacturing process, conducting depth-controlled uncoveringthrough a CO2 laser procedure after character printing. The PI protective film uncovering method of the rigid-flex printed circuit board has the advantages of being high in efficiency, good in quality and the like.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for uncovering a PI protective film of a rigid-flex board. Background technique [0002] During the production process of rigid-wound bonded boards, it is very difficult to manually remove the reinforcing material in the flex zone. In the existing process flow, the high-flow glue prepreg (normal flow PP) that has been washed in the inner tank is pressed once on the FCCL, and the conventional pressing process is used for normal pressing. This kind of existing technological process has a lot of PP glue flow during the lamination process, and the ink on the rigid plate near the rigid-flexible boundary line is easy to fall off, which makes it difficult to remove the cover, difficult to guarantee product quality, low yield rate, and seriously affects production efficiency. Contents of the invention [0003] The invention provides a method for uncovering a ...

AI Technical Summary

Problems solved by technology

This kind of existing technological process has a lot of PP glue flow during the pressing process, and the ink on the rigid board near the rigid-flexible boundary line is easy to fall off, which makes it difficult to remove the cover, difficult to guarantee product quality, low yield rate, and seriously affects production efficiency.

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