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Method and system for processing light-transmitting plate

A processing method and technology of light-transmitting plates, which are applied in the field of optical components and light-transmitting plate processing, can solve the problems of raw material demand and large waste, and achieve the effect of ensuring comprehensiveness

Active Publication Date: 2022-01-14
上海凝兰新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the slicing step will cause the surface of the substrate to warp. In order to ensure the normal progress of the subsequent grinding and polishing steps, it is necessary to reserve enough grinding and polishing allowances. In the case of constant substrate surface accuracy, the greater the warping, The greater the required grinding and polishing allowance, the greater the demand and waste of raw materials

Method used

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  • Method and system for processing light-transmitting plate
  • Method and system for processing light-transmitting plate
  • Method and system for processing light-transmitting plate

Examples

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Effect test

Embodiment 1

[0042] A method for processing a transparent plate, comprising the following steps:

[0043] S1: Substrate molding: Carry out gas phase hydrolysis of silane or siloxane compound through a gas phase hydrolysis container, deposit the particles after gas phase hydrolysis on the deposition plate to form a light-transmitting plate blank, and place the light-transmitting plate blank at a temperature of 1800 °C vacuum melting furnace for 30 minutes, then placed in a high-purity carbon mold for 80-90 minutes, preferably 90 minutes, so that the blank is formed into a desired shape; the blank is roughly cut to form a light-transmitting plate substrate, Wherein, the substrate can be formed in a quadrilateral, rectangular, square or circular shape, and its size can be set to be 500-1500 mm in diameter or side length, and 50-150 mm in thickness.

[0044] S2: Substrate surface treatment: The substrate has a pair of opposite main surfaces, which are not subjected to finishing treatment such ...

Embodiment 2

[0055] A light-transmitting plate processing system, including a substrate forming device, a substrate surface treatment device, a precise cutting thickness calculation device, and a light-transmitting plate forming device,

[0056] The substrate molding device includes a gas phase hydrolysis container, a deposition plate, a vacuum melting furnace, a high-purity carbon mold, and a rough cutting device. The gas phase hydrolysis of silane or siloxane compounds is carried out through the gas phase hydrolysis container, and the particles after gas phase hydrolysis are deposited on the deposition plate to form To form a light-transmitting plate blank, place the light-transmitting plate blank in a vacuum melting furnace whose temperature is adjusted to 1800° C. for 30 minutes, and then place it in a high-purity carbon mold for 80-90 minutes, preferably 90 minutes, so that the blank The piece is formed into the desired shape; the blank is roughly cut by a rough cutting device to form ...

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Abstract

The invention discloses a method and system for processing a light-transmitting plate, including substrate forming, substrate surface treatment, precision cutting thickness calculation, and light-transmitting plate forming steps, rough cutting a blank into a substrate, coating a surface treatment liquid on the surface of the substrate, and After the surface treatment, the surface of the substrate is evenly divided into several areas, and a birefringence measurement is performed at a point in each area, and the surface warpage is measured for each area, thereby determining the fine-cut thickness range of the substrate, according to the precision Cutting thickness range Fine cutting of the substrate, through reasonable control of the thickness of the fine-cut substrate, while ensuring sufficient grinding and polishing allowance, avoid excessive thickness of the fine-cut substrate, resulting in waste of raw materials.

Description

technical field [0001] The invention belongs to the field of optical elements, in particular to the field of light-transmitting plate processing. Background technique [0002] The light-transmitting panels in the prior art are usually prepared by forming a blank, slicing the blank into substrates, then grinding the substrates with a slurry containing an abrasive, and then polishing until the desired size, thickness and roughness are achieved. [0003] However, the slicing step will cause the surface of the substrate to warp. In order to ensure the normal progress of the subsequent grinding and polishing steps, it is necessary to reserve enough grinding and polishing allowances. In the case of constant substrate surface accuracy, the greater the warping, The greater the required grinding and polishing allowance, the greater the demand and waste of raw materials. Contents of the invention [0004] In order to solve the above problems, the present invention provides a method...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P15/00
CPCB23P15/00
Inventor 尤保华
Owner 上海凝兰新材料科技有限公司