Resin filling structure for inner layer of thick copper circuit board, and circuit board thereof
A thick copper circuit board, inner layer technology, applied in circuit devices, printed circuits, printed circuits, etc., can solve problems such as filling voids, and achieve the effect of reducing thickness and insufficient filling
Inactive Publication Date: 2020-12-11
鹤山市中富兴业电路有限公司
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Problems solved by technology
[0003] The purpose of this application is to solve at least one of the technical problems existing in the prior art, and to provide a resin filling structure for the inner layer of a thick copper circuit board, which can solve the problem of filling voids
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[0023] This section will describe the specific embodiments of the present application in detail, and the preferred embodiments of the present application are shown in the accompanying drawings. Each technical feature and overall technical solution of the application should not be construed as a limitation on the protection scope of the application.
[0024] In the description of this application, it should be understood that the orientation or positional relationship indicated in relation to orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the accompanying drawings, only For the convenience of describing the present application and simplifying the description, it is not indicated or implied that the referred device or element must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as a limitation of the present appli...
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Abstract
The invention discloses a resin filling structure for an inner layer of a thick copper circuit board, and a circuit board thereof. According to the invention, a copper layer and a filling layer are arranged on a core board base material which is arranged on a bottom layer side by side, the outer sides of the copper layer and the filling layer are flush with the two side faces of the core board base material respectively, a bleeding resin layer is pressed on the upper side surface of the filling layer, and a thin prepreg is arranged on the uppermost layer to form the circuit board. Compared with the prior art, the upper side of the core board base material is provided with the filling layer to provide a height basis, and then the bleeding resin layer is laminated, so the sum of the thickness of the bleeding resin layer and the filling layer is the same as the thickness of the copper layer, the thickness of the bleeding resin layer can be reduced, the problem of insufficient resin filling is effectively reduced, and defects caused by inner-layer resin filling cavities are avoided.
Description
technical field [0001] The present application relates to the field of circuit boards, and in particular, to an inner layer resin-filled structure of a thick copper circuit board and a circuit board thereof. Background technique [0002] At present, thick copper circuit boards are an important part of products such as power circuits or high-power circuits. Since the circuit boards need to pass a large current, under the condition of constant voltage, it is necessary to reduce the resistance of the circuit boards. A common practice is to increase the thickness of the copper layer when designing the circuit board. While increasing the thickness of the copper layer, it is necessary to fill the inner layer with glue to obtain a dielectric layer. With the demand for thinner and lighter products, the existing method is to maintain the thickness of the copper layer when the circuit board space is limited. On the premise, the thickness of the dielectric layer should be reduced, but...
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IPC IPC(8): H05K1/02
CPCH05K1/02H05K1/0256H05K2201/0191H05K2201/0203
Inventor 叶国俊
Owner 鹤山市中富兴业电路有限公司