A silicon chip patch removal method based on oil magnetic particle separation technology
A separation technology and magnetic particle technology, which is applied in the field of silicon wafer patch removal based on oil-magnetic particle separation technology, can solve the problems of strong randomness, insufficient degumming, and difficult and standardized operation of employees, so as to improve the cleanliness and reduce the viscosity. , the effect of improving the removal efficiency
Active Publication Date: 2022-01-25
SHENZHEN SALUS BIOMED CO LTD
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Problems solved by technology
[0004] The traditional degumming process is generally manual operation. The process is to soak the silicon wafer in a hot water tank above 40°C for 50-130 minutes. However, manual treatment may cause insufficient degumming. Strong, causing different degrees of damage to the surface and integrity of the silicon wafer
Method used
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Embodiment 1
[0045] See figure 1 A method of removing the magnetic particles based on silicon oil patch separation techniques, comprising the steps of:
[0046] Sl, the semiconductor silicon patch affixed pre-processing, the wedge-shaped groove defines a circle surface of the patch, and the two doors are shaped to snap the plastic frame 1 the wedge groove, formed soaked sheet;
[0047] S2, prepare a hot soaking solution, and thereto is added a detection reagent, after mixing, the mixture was heated to 40 ℃, then soaked tablets were placed into the plurality of the mixed solution, stirred to be uniformly distributed soaked sheet;
[0048] S3, the sheet after soaking 50min soak extraction, and the outside of the door to form a plastic buckle housing 1, the semiconductor wafer cause the patch was separated and the plastic housing by means of a portal to a semiconductor wafer wiping, thus completing the posted piece removed.
[0049] See Figure 2-5 , Sl to the gate-shaped plastic frame has an oute...
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The invention discloses a method for removing silicon chip patches based on oil magnetic particle separation technology, which belongs to the technical field of semiconductor silicon chips. This solution can promote the recovery of oil magnetic heat-changing guide ropes to a high-temperature phase state through the heat in the hot soaking liquid At the same time, with the help of the distance between the magnetic traction balls, the built-in storage bag can be forced to deform into a spherical shape under the reset action of the elastic reset rope, so as to release the acetone in it from the release hole. The movement and deformation of the separator and the oil magnetic heat-changing wire can effectively separate the patch from the semiconductor silicon chip. On the other hand, the release of acetone can reduce the viscosity between the patch and the semiconductor silicon chip. The hydrophilicity of the surface of the magnetic thermally variable guide rope can promote the accumulation of acetone on its surface, and with its movement, the acetone can be evenly distributed between the patch and the semiconductor silicon wafer, thereby improving the separation of the patch efficiency.
Description
Technical field [0001] The present invention relates to the technical field of semiconductor wafers, and more particularly, to a silicon based oil patch magnetic particle separation technology removal method. Background technique [0002] Refers to a room temperature electrical conductivity of the semiconductor material interposed between the conductor and the insulator, semiconductor integrated circuits have applications in consumer electronics, communication systems, photovoltaic power generation, lighting, power supply converters, and other fields, such as a diode is a semiconductor device fabricated using , both from a technological or economic development point of view, the importance of semiconductors are very large, most of the electronic products such as computers, mobile phones or digital recorders are among the core unit and the semiconductor has a very close association common semiconductor materials silicon, germanium, gallium arsenide, silicon semiconductor material,...
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IPC IPC(8): H01L31/18
CPCH01L31/1804Y02P70/50
Inventor 彭新林
Owner SHENZHEN SALUS BIOMED CO LTD