A high-efficiency LED packaging structure for fitting and heat dissipation
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 广西欣亿光电科技有限公司
- Publication Date
- 2021-12-31
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Abstract
Description
technical field
[0001] The invention relates to the technical field of LED packaging, in particular to a high-efficiency LED packaging structure in which parts are fitted together to dissipate heat. Background technique
[0002] LED (light-emitting diode) packaging refers to the packaging of light-emitting chips. Generally, LED packaging is dispensed on the LED bracket. After the glue is dispensed on the LED bracket, it can protect the wick and also be able to transmit light. Many manufacturers have semi-automatic dispensing equipment. At the same time, in order to pursue speed, these manufacturers have installed two glue guns on the semi-automatic dispensing equipment to increase the speed. The distance between the two glue guns on most of the existing semi-automatic equipment is However, the distance between the positions of the LED lamp beads on the LED bracket is different, so that only a single LED bracket can be packaged and dispensed, which reduces the practicability ...