A high-efficiency LED packaging structure for fitting and heat dissipation

A LED encapsulation and bonding technology, which is applied to electrical components, injection devices, semiconductor devices, etc., can solve the problems of adjusting the distance between two glue guns, troubles, etc., and achieve the effect of reducing the difficulty of getting started, simple operation, and improving practical effects

Active Publication Date: 2021-12-31
广西欣亿光电科技有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a high-efficiency LED packaging structure for fitting and heat dissipation, which has the advantages of convenient adjustment of the distance between the two glue guns, and solves the problem of the distance between the two glue guns. Troubleshooting problems

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  • A high-efficiency LED packaging structure for fitting and heat dissipation
  • A high-efficiency LED packaging structure for fitting and heat dissipation
  • A high-efficiency LED packaging structure for fitting and heat dissipation

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see Figure 1-Figure 6, the present invention provides a new technical solution: a high-efficiency LED packaging structure for fitting and heat dissipation, including a placement base 1, a movement mechanism 2 is arranged on the upper surface of the placement base 1, and the vertical direction of the movement mechanism 2 The front side surface of the sliding block is fixedly connected with a support plate 3, the upper end of the right side surface of th...

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Abstract

The invention relates to the technical field of LED packaging, and discloses a high-efficiency LED packaging structure for attaching and dissipating heat. One end is rotatably connected with a rotating connecting block, and two rotating blocks are respectively fixedly connected on the front and rear surfaces of the rotating connecting block, and the opposite ends of the two rotating blocks are rotatably connected with a rotating rod, and the rotating rod A slide block is rotatably connected to one end away from the rotating connection block, and a glue gun is fixedly connected to the surface of the slide block away from the support plate. The assembly fits the heat-dissipating high-efficiency LED packaging structure to adjust the distance between the glue gun and the glue gun, so that the lamp beads on different LED brackets can be dispensed. The device is easy to operate and does not require too much The steps are cumbersome, and the distance between the two glue guns can be adjusted only by rotating the rotating lever.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a high-efficiency LED packaging structure in which parts are fitted together to dissipate heat. Background technique [0002] LED (light-emitting diode) packaging refers to the packaging of light-emitting chips. Generally, LED packaging is dispensed on the LED bracket. After the glue is dispensed on the LED bracket, it can protect the wick and also be able to transmit light. Many manufacturers have semi-automatic dispensing equipment. At the same time, in order to pursue speed, these manufacturers have installed two glue guns on the semi-automatic dispensing equipment to increase the speed. The distance between the two glue guns on most of the existing semi-automatic equipment is However, the distance between the positions of the LED lamp beads on the LED bracket is different, so that only a single LED bracket can be packaged and dispensed, which reduces the practicability ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C11/00B05B15/50H01L33/48H01L33/52
CPCB05C5/0212B05C5/027B05B15/50B05C11/00H01L33/48H01L33/52H01L2933/0033H01L2933/005
Inventor 吴先泉
Owner 广西欣亿光电科技有限公司
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