High-heat-conduction buffer gasket

Abstract

The invention provides a high-heat-conduction buffer gasket, which comprises a PET film, wherein a buffer layer is arranged on the upper surface of the PET film, an adhesive layer is arranged on the lower surface of the PET film, a release layer is arranged on the lower surface of the adhesive layer, and the buffer layer is an insulating and heat-conducting silica gel layer or a PU buffer layer. According to the invention, heat conduction and buffer compression springback are integrated, good heat conduction, buffer and compression springback performances are achieved, the high-heat-conductionbuffer gasket can be used for buffer, shock absorption and heat dissipation of an OLED flexible screen, has good practicability and feasibility, and can be applied to the OLED flexible screen according to whether application requirements are insulated, and the electric conduction and heat conduction powder can be selected as an additive and copper foil or other metal foils can be selected as basematerials, so that the heat conduction performance is improved.

Description

technical field [0001] The invention relates to the technical field of cushioning tapes for electronic applications, in particular to a cushioning pad with high thermal conductivity. Background technique [0002] With the popularization of electronic products, when major electronic products, such as mobile phones, computers, TVs, and tablets, are pursuing ultra-thin and lightweight, the thickness of traditional LCDs is generally above 3mm, which cannot meet the development of electronic displays. At the same time, OLED The display has demonstrated the incomparable advantages of LCD, while OLED buffer heat dissipation materials are still blank in China. Therefore, the present invention urgently needs to design a high-buffering, high-compression resilience material and a high thermal conductivity insulating material to form a new type of gasket suitable for OLED screen support, shock absorption, and module heat dissipation to make up for the OLED screen buffer thermal conducti...

AI Technical Summary

Problems solved by technology

[0002] With the popularization of electronic products, when major electronic products, such as mobile phones, computers, TVs, and tablets, are pursuing ultra-thin and lightweight, the thickness of traditional LCDs is generally above 3mm, which cannot meet the development of electronic displays. At the same time, OLED The display has demonstrated the incomparable advantages of LCD, while OLED buffer heat dissipation materials are still blank in China

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