A double-sided heat exchange micro-channel liquid cooling radiator

A micro-channel, liquid-cooled heat dissipation technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of large flow resistance, energy loss, large operating noise, etc., to reduce flow resistance , The effect of reducing the coefficient of frictional resistance

Active Publication Date: 2022-06-07
WUHAN SECOND SHIP DESIGN & RES INST
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  • Abstract
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  • Claims
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Problems solved by technology

However, due to the small channel size of the double-sided heat exchange micro-channel liquid cooling radiator, its flow resistance is large and the flow pressure loss is also large. Generally, a high-power circulation pump is required to drive the fluid flow, and the use of a high-power circulation pump , not only causes additional energy loss, but also causes greater operating noise

Method used

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  • A double-sided heat exchange micro-channel liquid cooling radiator
  • A double-sided heat exchange micro-channel liquid cooling radiator
  • A double-sided heat exchange micro-channel liquid cooling radiator

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Embodiment Construction

[0034] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0035] Combine below figure 1 The double-sided heat exchange micro-channel liquid-cooled radiator provided by the embodiment of the present invention is described. The double-sided heat-exchange micro-channel liquid-cooled radiator includes: a plurality of liquid-cooled heat dissipation modules 1 .

[0036] For convenience of expla...

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Abstract

The invention provides a double-sided heat exchange micro-channel liquid-cooled radiator, which includes several liquid-cooled heat dissipation modules; two cooling liquid channels and a magnetic fluid channel; the magnetic fluid channel is provided with two sections, respectively equipped with magnets with opposite magnetic poles and an electrode assembly with opposite electrode directions; the two cooling liquid channels respectively correspond to two sections of the magnetic fluid channel, and each section communicates with a cooling liquid channel. The heat sink provided by the present invention uses two coolant channels to cool the heat source at the same time, realizing double-sided heat exchange. The radiator also uses the electromagnetic field to drive the magnetic fluid to circulate in the magnetic fluid channel, thereby driving the cooling liquid connected to its side to run, so that the original liquid-solid contact mode between the cooling liquid and the wall surface is transformed into a liquid-solid contact mode between the cooling liquid and the magnetic fluid. The liquid-liquid contact method of the fluid greatly reduces the frictional resistance coefficient of the contact surface. At the same time, the movement of the magnetic fluid is used to change the contact surface of the cooling liquid from the original non-slip wall surface to the slip wall surface, which plays a role of low-resistance heat dissipation. Effect.

Description

technical field [0001] The invention relates to the field of efficient heat dissipation of electronic devices, in particular to a double-sided heat exchange micro-channel liquid cooling radiator. Background technique [0002] With the development of MEMS technology, the degree of integration and high frequency of electronic devices continues to increase, the feature size continues to decrease, the heat generation per unit volume continues to increase, and the compact design of equipment makes it more difficult to dissipate heat. Therefore, there is an urgent need for Solve the technical problems of efficient heat dissipation. Traditional air-cooled and large-sized pipeline liquid convection heat transfer technology is difficult to take away a large amount of heat in time, resulting in an increase in the temperature of electronic devices, which greatly reduces its practicability and reliability. Therefore, the heat dissipation technology of high heat flux in small space has ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20218H05K7/20272Y02B30/00
Inventor 黄崇海林原胜王苇庞杰吕伟剑陈列魏志国李邦明陈朝旭邱志强王俊荣肖颀陈凯戴春辉李勇张克龙苟金澜柯志武吴君柯汉兵
Owner WUHAN SECOND SHIP DESIGN & RES INST
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