Heat dissipation system of electrical equipment

Abstract

The invention discloses a heat dissipation system of electrical equipment, and the system comprises an electrical unit, a heat exchange unit and a refrigeration unit, wherein the heat exchange unit comprises an evaporation cavity, a condensation cavity and a reflux box; the evaporation cavity is communicated with the condensation cavity, the reflux box is fixedly arranged at the bottom of the condensation cavity, and a coolant collection tank is arranged in the reflux box. A partition plate is movably connected into the coolant collecting tank, and a control mechanism is arranged in the control mechanism tank. In the using process, through the cooperation of an extrusion rod and all control plates, it is achieved that when a coolant is condensed in a condensation cavity, the coolant is kept under a high pressure condition, and the cooperation among a column, an extrusion spring and an electromagnet is hindered at the same time; the partition plate can be opened only when the coolant inthe condensation cavity is in a high-pressure supercooling state, so the coolant enters the capillary channel, and the problem that the refrigerating efficiency is insufficient due to the fact that alarge amount of flash evaporation occurs when the low-pressure coolant enters the capillary channel is solved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electrical equipment, in particular to a heat dissipation system of electrical equipment. Background technique [0002] At present, the heat dissipation methods mainly include air convection cooling, liquid convection cooling, phase change evaporative cooling, semiconductor cooling and heat pipe heat conduction cooling, etc. The most widely used in the prior art are mainly air convection cooling and liquid convection cooling, but these two cooling The heat transfer efficiency of the method is low, and it is necessary to increase the heat dissipation parts to achieve the ideal cooling capacity, which brings great problems to the arrangement of the heat dissipation parts. [0003] In the prior art, the application number is "201811265139.3", an air-conditioning electrical box and its heat dissipation device, including a semiconductor cooling sheet, a heat insulation film and a heat sink,...

AI Technical Summary

Problems solved by technology

[0006] However, there are still many defects in the above-mentioned technology, such as: in the above-mentioned technology, the coolant is evaporated by the heat source, and the coolant evaporates to provide cooling capacity. After the coolant evaporates, it rises to the upper wall of the evaporation layer and is cooled by the cooling layer to a liquid state, and then falls back under the evaporation layer. On the wall, when the gaseous coolant condenses into a liquid state, the pressure in the evaporation layer decreases due to the reduction of gaseous molecules, forming a low-pressure coolant, which cannot form a high-pressure supercooled coolant. When the low-pressure liquid coolant returns through the capillary structure in the evaporation chamber , the "flash" phenomenon occurs due to throttling, so that part of the liquid coolant becomes gaseous coolant again, which reduces the amount of liquid coolant entering the bottom wall of the evaporation chamber and reduces the cooling and heat dissipation efficiency

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