DDR interface circuit fault diagnosis method and device for high-density chip

Abstract

The invention discloses a DDR interface circuit fault diagnosis method and device for a high-density chip, and the device comprises a mainboard and a test module, wherein the mainboard comprises a chip and a DDR seat; the test module comprises an LED indicating lamp Dn, an adjusting resistor RTn, and a power supply module POWER, and the test module is connected with the mainboard through the DDR seat. Compared with the prior art, the method has the advantages that hardware design is simple, software is not needed, cost is low, a mainboard does not need to be powered on, the method can adapt todifferent chips, operation is easy and visual, the research and development cost of a company can be greatly saved, and the research and development period of the company can be greatly shortened.

Description

technical field [0001] The invention relates to the technical field of high-density BGA chip circuit testing, in particular to a method and device for fault diagnosis of a DDR interface circuit of a high-density chip. Background technique [0002] At present, with the development of electronic products in the direction of miniaturization and high performance, the design density of motherboard CPU or FPGA chip is getting higher and higher. This kind of high-density BGA chip has more and more pins, and the PIN spacing is getting smaller and smaller. Among them, the DDR interface circuit of the chip occupies a lot of pin circuits. A chip is often designed to use the signals of multiple sets of DDR memory sticks. It brings challenges to the fault diagnosis of DDR circuit soldering. [0003] There are two common ways of fault diagnosis at present. [0004] One is to use professional X-ray detection equipment. Commonly used X-ray detection instruments include two-dimensional X...

AI Technical Summary

Problems solved by technology

And the operation is simple, no special technical personnel

Images