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Test structure and preparation method thereof

A technology for testing structures and electrode layers, which is applied in electronic circuit testing, components of electrical measuring instruments, and electrical measurement, etc. The effect of good contact and simple processing technology

Active Publication Date: 2021-01-08
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] The inventor found at least the following problems in the prior art: It is difficult for the LED chip test probe to make good contact with the electrodes on the Micro-LED chip, so it is difficult to realize Micro-LED Chip electrical test

Method used

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  • Test structure and preparation method thereof
  • Test structure and preparation method thereof

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Embodiment Construction

[0023] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, various implementation modes of the present invention will be described in detail below in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that in each implementation manner of the present invention, many technical details are proposed in order to enable readers to better understand the present invention. However, even without these technical details and various changes and modifications based on the following implementation modes, the technical solution claimed in the present invention can also be realized.

[0024] The first embodiment of the present invention relates to a test structure 100, the specific structure is as figure 1 and figure 2 shown, including:

[0025] The substrate 1, the deformable layer 2 on the substrate 1, the first electrode layer 31 on the deformable layer 2 and the el...

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Abstract

The embodiment of the invention relates to the technical field of display, and discloses a test structure and a preparation method of the test structure, and the test structure comprises a substrate,a deformation layer arranged on the substrate, a first electrode layer arranged on the deformation layer, and an electric contact structure; when the first electrode layer is powered on, the deformation layer protrudes in q direction away from the surface of the substrate, so that the electric contact structure moves in a direction away from the surface of the substrate. According to the test structure and the preparation method of the test structure provided by the invention, the electrical test of the to-be-tested chip can be realized, and the processing technology is simple.

Description

technical field [0001] The embodiments of the present invention relate to the field of display technology, and in particular to a test structure and a method for preparing the test structure. Background technique [0002] In the field of Micro-LED display panel processing, batch transfer technology can realize the high-speed transfer of a large number of Micro-LED chips to the driver backplane, which is a key technology to reduce the processing cost of Micro-LED display body and improve the process yield. Before implementing batch transfer, it is necessary to test the Micro-LED chip array, and use the Mapping method to calibrate the chips with good electrical performance. In other words, batch transfer technology needs to select Micro-LED chips with good electrical properties for batch transfer, which is the premise to ensure the effectiveness of batch transfer implementation. In the prior art, Micro-LED chips are tested by LED chip test probes. [0003] The inventors have...

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Application Information

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IPC IPC(8): G01R31/28G01R1/067
CPCG01R31/2806G01R1/06727G01R1/06794
Inventor 邢汝博
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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