Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

PCB baking device

A technology of PCB circuit board and baking device, applied in the directions of printed circuit, printed circuit manufacturing, printed circuit drying, etc., can solve the problems of environmental pollution, low utilization rate of heat, etc., to improve baking efficiency, accelerate heat dissipation, The effect of improving the utilization rate of heat

Pending Publication Date: 2021-01-08
朱莉均
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a PCB circuit board baking device for the problem that the current PCB baking device does not have a high heat utilization rate and will cause environmental pollution

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PCB baking device
  • PCB baking device
  • PCB baking device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. If the words "up", "down", "left" and "right" appear in the following, it only means that they are consistent with the directions of up, down, left and right in the drawings themselves, and do not limit the structure.

[0027] Such as Figure 1~4 A PCB circuit board baking device shown includes a baking device main body 1, a sealing door 2 and a degassing device 5. The front of the baking device main body 1 is movably connected with a sealing door 2, and one side of the sealing do...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a PCB baking device, and belongs to the field of production and processing equipment. According to the technical scheme, the baking device comprises a baking device body, a sealing door and a degassing device, the sealing door is movably connected to the front face of the baking device body, the degassing device is fixedly connected to the middle of one side of the baking device body, and a device base is fixedly connected to the bottom of the baking device body; a heat conduction plate is fixedly connected to the top of the interior of the baking device body, a limiting spring is fixedly connected to one end of the heat conduction plate, a connecting plate is fixedly connected to the bottom of the heat conduction plate, a PCB clamping groove is fixedly connected toone side of the limiting spring, the practicability of the device body is improved through the PCB clamping groove, and the environmental protection property of the device body is improved through adegassing device. The heat conduction plate improves the heat utilization rate of the device main body, and PCB baking device is more suitable for baking the PCB.

Description

technical field [0001] The invention belongs to the field of production and processing equipment, and in particular relates to a PCB circuit board baking device. Background technique [0002] PCB circuit board, also known as printed circuit board, is a provider of electrical connections for electronic components. Its processing process is extremely complicated. After processing, it is necessary to use a professional drying device to dry the paint and moisture on the surface. [0003] The heat utilization rate of the existing PCB circuit board baking device is not high, which leads to a large amount of energy waste and reduces the work efficiency of the staff. The PCB circuit board after baking must be completely cooled before it can be used. Most of the baking devices do not directly install a cooling system inside the device to accelerate the cooling of the PCB circuit board, which affects the benefits of the factory. The PCB circuit board will produce harmful gases during ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/22
CPCH05K3/227H05K2203/082
Inventor 朱莉均
Owner 朱莉均
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com