The application provides a heat dissipation material for
electronic packaging and a preparation method thereof, and belongs to the technical field of heat dissipation materials. After
tourmaline is subjected to ball milling and cleaning treatment, the surface of the
tourmaline is coated with a layer of
tungsten-
copper-silver
alloy, and a layer of
graphene oxide is further deposited on the surface; after reduction by hydrazine
hydrate, modified nanoballs are obtained; the modified nanoballs are uniformly mixed with red
copper powder, ball milled, cold-pressed, and sintered at high temperature and
high pressure to obtain the heat dissipation material for
electronic packaging. The application prepares a heat dissipation material for
electronic packaging with
high heat dissipation and high mechanical properties, and the heat dissipation material has higher
thermal conductivity than a traditional heat dissipation substrate, so that heat can be directly dissipated through the substrate in SiP packaging, thick mold packaging and
high heat dissipation packaging technology, the
heat transfer path is shortened, the heat dissipation effect is enhanced, and the application range is wider.