Manufacturing method of ceramic circuit board capable of enhancing silver migration resistance of platinum-palladium-silver conductor
A technology of ceramic circuit board and manufacturing method, which is applied in the fields of printed circuit manufacturing, printed circuit, conductive pattern formation, etc., and can solve the problem of decreased anti-silver migration ability of platinum-palladium-silver conductors, poor anti-silver migration ability, circuit board short-circuit scrapping, etc. problems, to achieve the effect of strengthening anti-silver migration ability, reducing short-circuit scrapping, and enhancing density
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0027] Such as figure 1 Shown, a kind of ceramic circuit board manufacturing method of the present invention can strengthen platinum-palladium-silver conductor anti-silver migration ability, it may further comprise the steps:
[0028] (1) Containing 92-99% Al 2 o 3 Platinum palladium silver conductor paste is printed on the alumina ceramic substrate, after drying process (160°C drying for more than 5 minutes), it is sintered at high temperature and constant temperature in a sintering furnace (850°C±2°C high temperature constant temperature sintering for 10 minutes) ), so that the platinum-palladium-silver conductor and the ceramic plate produce a bonding force to form a wire circuit; then, according to the requirements of the circuit diagram, the resistance paste is printed on the wire circuit on the alumina ceramic substrate.
[0029] (2) Print the glass glaze paste on the wire position on the alumina ceramic substrate, and then dry it through the same drying process (dryin...
Embodiment 2
[0033] Such as figure 1 Shown, a kind of ceramic circuit board manufacturing method of the present invention can strengthen platinum-palladium-silver conductor anti-silver migration ability, it may further comprise the steps:
[0034] (1) Containing 92-99% Al 2 o 3 Platinum palladium silver conductor paste is printed on the alumina ceramic substrate, after drying process (140°C for more than 5 minutes), it is sintered at high temperature and constant temperature in a sintering furnace (850°C±2°C for 9 minutes at high temperature and constant temperature) ), so that the platinum-palladium-silver conductor and the ceramic plate produce a bonding force to form a wire circuit; then, according to the requirements of the circuit diagram, the resistance paste is printed on the wire circuit on the alumina ceramic substrate.
[0035] (2) Print the glass glaze paste on the wire position on the alumina ceramic substrate, and then dry it through the same drying process (drying at 140°C ...
Embodiment 3
[0039] Such as figure 1 Shown, a kind of ceramic circuit board manufacturing method of the present invention can strengthen platinum-palladium-silver conductor anti-silver migration ability, it may further comprise the steps:
[0040] (1) Containing 92-99% Al 2 o 3 Platinum palladium silver conductor paste is printed on the alumina ceramic substrate, after drying process (170°C drying for more than 5 minutes), it is sintered at high temperature and constant temperature in a sintering furnace (850°C ± 2°C high temperature constant temperature sintering for 12 minutes) ), so that the platinum-palladium-silver conductor and the ceramic plate produce a bonding force to form a wire circuit; then, according to the requirements of the circuit diagram, the resistance paste is printed on the wire circuit on the alumina ceramic substrate.
[0041] (2) Print the glass glaze paste on the wire position on the alumina ceramic substrate, and then dry it through the same drying process (dry...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More