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Generation method and device for DAF-attached small substrate, storage medium and electronic equipment

A small substrate and attaching technology, applied in circuits, electrical components, metal processing, etc., can solve the problems of complicated and cumbersome processes, time-consuming and laborious, wire drawing, etc., and achieve the goal of reducing process complexity, reducing wire drawing problems, and saving substrate costs. Effect

Active Publication Date: 2021-01-22
BIWIN STORAGE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the production process, it is first cut into small substrates and then attached to the DAF, and then attached to the large substrate 7 after cutting. The process is complex and cumbersome, time-consuming and labor-intensive. drawing problem

Method used

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  • Generation method and device for DAF-attached small substrate, storage medium and electronic equipment
  • Generation method and device for DAF-attached small substrate, storage medium and electronic equipment
  • Generation method and device for DAF-attached small substrate, storage medium and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] According to the above, combined with Figure 1 to Figure 6 , Embodiment 1 of the present invention is:

[0062] A small substrate generation method for attaching DAF, comprising steps:

[0063] S1, attaching DAF4 to the reverse side of the initial packaging substrate 3 on which no wiring is laid, to obtain the packaging substrate to be cut;

[0064] In this embodiment, the initial packaging substrate 3 distinguishes the front and back sides according to whether or not the circuits are laid out, wherein the side with the lines is the front side, and the side without the lines is the reverse side. Therefore, when cutting, the initial package substrate 3 3, the reverse side of which no lines are laid is facing upwards, attach DAF4 to the reverse side of the original packaging substrate 3, and use a roller to roll the side of DAF4 away from the original packaging substrate 3, so that DAF4 is completely attached to the original packaging substrate 3 on.

[0065] S2. Dete...

Embodiment 2

[0083] According to the above, combined with Figure 1 to Figure 6 , the second embodiment of the present invention is:

[0084] A method for generating a small substrate with DAF attached. On the basis of the first embodiment above, the cutting parameters of this embodiment are specifically: the rotational speed of the cutter shaft is 37500r / min, the cutting speed is 6mm / s, and the water flow rate is 1.3L / min. min, the height between the outer circle of the soft knife blade 5 and the working table is 0.065mm.

Embodiment 3

[0085] According to the above, combined with Figure 1 to Figure 6 , Embodiment three of the present invention is:

[0086] A method for generating a small substrate with DAF attached. On the basis of the first embodiment above, the cutting parameters of this embodiment are specifically: the rotational speed of the cutter shaft is 40000r / min, the cutting speed is 7mm / s, and the water flow rate is 1.4L / min. min, the height between the outer circle of the soft knife blade 5 and the working table is 0.072mm.

[0087] It can be seen from this that, in other embodiments, as long as the rotating speed of the cutter shaft is 35000-40000r / min, the cutting speed is 5-7mm / s, and the water flow rate is 1.2-1.4L / min, the distance between the outer circle of the soft knife blade 5 and the working table The height between them can be 0.058-0.072mm.

[0088] Please refer to Figure 7 , Embodiment 4 of the present invention is a DAF4-attached small substrate generation device 1 correspondi...

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Abstract

The invention discloses a generation method and device for a DAF-attached small substrate, a storage medium and electronic equipment. The method comprises the following steps: enabling a DAF to be attached to the reverse side, where no circuit is laid, of an initial packaging substrate so as to obtain a to-be-cut packaging substrate; and conducting cutting from the front face of the packaging substratea by using a soft knife blade to obtain the DAF-attached small substrate, wherein the soft knife blade is made of artificial diamond with a particle size ranging from 800 to 1200 and particle density ranging from 40 to 60. According to the invention, after the DAF is attached to the reverse side of the initial packaging substrate without the circuit, the soft knife blade made of the artificial diamond with the particle size of 800-1200 and the particle density of 40-60 is used for cutting, so wire drawing problems can be effectively reduced, cutting twice in the prior art is not needed, process complexity is reduced, labor cost and ubstrate cost are saved, and manufacturing cost is saved.

Description

technical field [0001] The invention relates to the technical field of memory chip manufacturing, in particular to a method, device, storage medium and electronic equipment for forming a small substrate attached with DAF. Background technique [0002] DAF (Die Attach Film) is a die-attaching film. Its purpose is to cut and separate the chips together and peel off (film expansion) during laser cutting, so that the chips after cutting can still be adhered to the film without due to Cutting results in random arrangement. [0003] In the existing production process, such as figure 2 As shown, the wafer 6 is attached to the large substrate 7 through the DAF, and is integrated with the large substrate 7 through the adhesiveness of the DAF, and subsequent routing is performed. Due to different customer needs, the positions of the wafer PAD (wafer 6 pins) are different, and a small substrate is required for bridging 8 to achieve several different types of wafers (wafer 6 ) on one ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/78B26D1/00
CPCH01L21/67132H01L21/78B26D1/0006B26D2001/002
Inventor 孙成思孙日欣朱茂林
Owner BIWIN STORAGE TECH CO LTD