Manufacturing method of semiconductor device, and semiconductor device
A manufacturing method and semiconductor technology, applied in semiconductor devices, electric solid state devices, electrical components, etc., can solve problems such as crosstalk, and achieve the effects of reducing interference, improving effectiveness and reliability
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[0062] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.
[0063]It will be understood that although the terms first, second, etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are used to distinguish one component from another. For example, a first component could be termed a second component, and, similarly, a second component could be termed a first component, without departing from the scope of the present invention.
[0064] It will be understood...
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