Preparation method of LED light-emitting device, and LED light-emitting device

Abstract

The invention provides a preparation method of an LED light-emitting device. The preparation method comprises the steps that S1, LED particles or LED chips are attached to a substrate of a LED light-emitting device; S2, the concave part of a lens insert on a lens mold plate is filled with a curing glue; S3, the substrate obtained in the step S1 is inversely pressed on the lens mold plate obtainedin the step S2, wherein the positions of the LED particles or the LED chips correspond to about the middle position of the concave part of the lens insert; and S4, the substrate and the lens mold plate which are pressed together in the step S3 are cured, after the curing glue is cured, the curing glue, the LED particles or the LED chips and the substrate are fixed together, and after mold opening,a LED light-emitting device is obtained. The invention further provides an LED light-emitting device, which is characterized in that LED particles or LED chips are located at the position about the middle of a lens, the lens is only provided with one optical face, and the lens is directly formed in a compression molding mode through a curing glue.

Description

technical field [0001] The present invention relates to the technical field of display devices, and more particularly, to a method for preparing an LED light emitting device and the LED light emitting device. Background technique [0002] The backlight modules of TV or computer display devices are divided into side-type backlight modules and direct-type backlight modules, and the biggest difference between side-type backlight modules and direct-type backlight modules is that direct-type backlight modules are relatively Compared with the side-type backlight module, there is no need to install a light guide plate, which has the advantage of high quality and low price; at the same time, the direct-type backlight module uses LED backlight to make a dense dot matrix, which is placed behind the screen and directly illuminates the screen. After being homogenized by the optical film, a surface light source with uniform light is formed, with clear picture quality and good picture eff...

AI Technical Summary

Problems solved by technology

[0003] The direct-type backlight module generally includes from bottom to top: backplane, LED backlight, diffusion plate, and other optical films. The LED backlight includes multiple LED light-emitting devices. Light-emitting devices include: LED strips, Miniled backlight boards, etc. Since the direct-type backlight module uses the light emitted by the LED backlight to directly illuminate the screen, that is, the light is directly scattered, so the required height of mixed light is relatively high, resulting in direct-type backlight modules. The thickness of the backlight module is greater than that of the side-type backlight module, and it has always been difficult to achieve slimming

[0004] LED light-emitting devices are generally composed of substrates and LED particles. In order to pursue the thinning of direct-lit backlight modules, LED light-emitting devices will mount lenses on top of LED particles. However, the traditional process of mounting lenses is to use SMT chips. The method of pasting the lens on the top of the LED particles has high requirements on the process, the output per unit time is too small, the production efficiency is low, and the cost is high.

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