Self-adaptive method and device based on heat dissipation of mainboard on AR/VR equipment

Abstract

The embodiment of the invention discloses a self-adaptive method and device based on heat dissipation of a mainboard on AR / VR equipment, and the method comprises the steps of: selecting a corresponding preset algorithm according to the type of a user triggering application when a wind speed management interface module receives the information of the user triggering application, and transmitting the preset algorithm to a wind speed service implementation module; enabling the wind speed service implementation module to send a mainboard temperature reading instruction to a local processing moduleat preset time intervals; collecting the temperature of the mainboard through a heating control driver of the mainboard and a temperature sensor and sending the temperature to the wind speed serviceimplementation module by a local processing module; and calculating a wind speed value according to the temperature of the mainboard through the use of a preset algorithm by the wind speed service implementation module, and adjusting the rotating speed of a cooling fan by controlling a fan control device through a fan control driver of the cooling fan according to the wind speed value. The methodcan adapt to different application scenes of AR / VR, the rotating speed of the cooling fan can be flexibly and dynamically controlled, the energy consumption of the cooling fan is reduced, the rotatingspeed of the fan is smoothly converted, and the problems of jumping and the like are avoided.

Description

technical field [0001] The present invention relates to the technical field of electronic equipment, in particular to an adaptive method and device for heat dissipation of a motherboard based on AR / VR equipment. Background technique [0002] AR (full name in English: Augmented Reality, full name in Chinese: augmented reality) / VR (full name in English: VirtualReality, full name in Chinese: virtual reality) The motherboard of the device includes CPU (full name in English: Central Processing Unit, full name in Chinese: central processing unit), GPU (English full name: Graphic Processing Unit, Chinese full name: graphics processor), PMIC (English full name: Power Management integrated circuit, Chinese full name: power management integrated circuit), Camera (Chinese name: camera), memory and other modules, along with Motherboard technology is becoming more and more sophisticated. In order to make AR / VR devices stable in power consumption, longer in use, and richer and more durabl...

AI Technical Summary

Problems solved by technology

[0003] The heat dissipation technology of AR / VR equipment usually includes the following two methods. One is to adopt a fixed wind speed regardless of any scene. The disadvantage of this method is high power consumption and inflexibility. If the maximum wind speed of the fan radiator is used, the noise is relatively large; The other adopts multi-level wind speed control, and uses the same wind speed within a certain temperature range. The disadvantage of this method is that when the critical temperature of the gear is reached, the fan will have a large jump

In addition, there are other ways to solve the heat dissipation problem of the motherboard. For example, the patent publication No. CN209690631U "Heat Dissipation Structure and VR Equipment" solves the problem of heat dissipation and deformation of the motherboard. There is an elastic member between the cooling plate and the main board. Although the problem of deformation caused by the difference in thermal expansion coefficient between the main board and the cooling plate of the heat dissipation structure is solved, this solution will increase the volume of the device, and the application scenarios are also limited; for example, Patent Publication No. CN108345111A "A VR Device with Efficient Heat Dissipation" mainly uses air vents, exhaust fans, heat conduction columns, etc. to export the heat from the display panel and the heat dissipation main board to reduce the temperature of the device and ensure the normal operation of the VR device. This method is inflexible and wastes power consumption

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