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A kind of LED display module packaging method

A packaging method and a display module technology, which are applied to spraying devices, devices for coating liquid on the surface, coatings, etc., can solve the problems of small LED display modules, increased dispensing and injection errors, and poor device stability. , to achieve the effect of improving accuracy, improving stability and preventing colloidal solidification

Active Publication Date: 2021-11-19
安徽绿保电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a LED display module packaging method to solve the problem that the existing packaging device proposed in the background technology is in use, because the existing glue dispensing and injection device is easily affected by the external temperature when injecting glue. The impact of solidification is difficult to remove at the injection pipe, and the LED display module is small, and the stability of the existing device is poor when dispensing and injecting, which will increase the error of dispensing and injecting and reduce the production efficiency.

Method used

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  • A kind of LED display module packaging method
  • A kind of LED display module packaging method
  • A kind of LED display module packaging method

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Embodiment 1

[0039] see Figure 1-5 , the present invention provides a technical solution: a LED display module packaging method, including a machine 1, the top of the machine 1 is provided with a boss 2, the bottom of the boss 2 is fixedly connected to the top of the machine 1, the boss The top of the insulation cylinder 3 is fixedly installed with the insulation cylinder 3, the inner wall of the insulation cylinder 3 is fixedly installed with a clamping platform, the outer wall of the insulation cylinder 3 is fixedly installed with an adjustment shaft, and the outer wall of the adjustment shaft is movably installed with a fixed rod 4. The top of the machine table 1 is set There is an air supply pipe 5, the outer wall of the air supply pipe 5 is flexibly connected with the inner wall of the machine 1, the end of the air supply pipe 5 far away from the machine 1 is provided with a limit flap 6, and the inner wall of the limit flap 6 is fixedly connected with the outer wall of the air supply...

Embodiment 2

[0042] see Figure 1-Figure 4 , on the basis of Embodiment 1, the present invention provides a technical solution: the top of the boss 2 is fixedly installed with a packaging base 7, the inside of the packaging base 7 includes a supporting platform 701, and the inner wall of the supporting platform 701 is fixedly installed with a mounting The platform 702 and the interior of the installation platform 702 are provided with a positioning column 703 , the bottom of the positioning column 703 is fixedly connected with the inner wall of the installation platform 702 , and the inner wall of the installation platform 702 is clamped with a thermal insulation board 704 . The inner wall of the mounting table 702 is fixedly equipped with a lead screw 705, and the outer wall of the lead screw 705 is movably equipped with a support platform 8. The inside of the support platform 8 includes a connecting cylinder 801, and the outside of the connecting cylinder 801 is provided with a fixed plat...

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Abstract

The invention discloses a method for packaging LED display modules, which belongs to the technical field of LED packaging. The method for packaging LED display modules includes a machine platform. The top of the platform is fixedly connected, the top of the boss is fixedly installed with a thermal insulation tube, the inner wall of the thermal insulation tube is fixed with a clamping platform, the outer wall of the thermal insulation tube is fixed with an adjustment shaft, and the outer wall of the adjustment shaft is movable. A fixed rod is installed, and the top of the machine is provided with an air supply pipe, the outer wall of the air supply pipe is movably connected with the inner wall of the machine, and the end of the air supply pipe far away from the machine is provided with a limit flap, The inner wall of the plate is fixedly connected with the outer wall of the air supply pipe, and the top of the boss is fixedly installed with a packaging base. The rubber injection pipe can be insulated through the insulation cylinder, and the insulation cylinder can serve as the position of the glue injection device to determine the zero point of the glue injection device, which is convenient for calibration and positioning of the glue injection device, and reduces the error of dispensing.

Description

technical field [0001] The invention belongs to the technical field of LED encapsulation, and in particular relates to an LED display module encapsulation method. Background technique [0002] LED (semiconductor light-emitting diode) packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. The packaging of the LED is not only required to be able to protect the wick, but also to be able to transmit light. Therefore, LED packaging has special requirements for packaging materials. Generally speaking, the function of packaging is to provide enough protection for the chip to prevent the chip from failing due to long-term exposure in the air or mechanical damage, so as to improve the stability of the chip; for LED packaging, it also needs to have good light extraction efficiency and good heat dissipation , Good packaging can make the LED have better luminous efficiency and heat dissipation environment, thereby improvi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C13/02B05C5/00B05B15/50B05D1/26H01L21/67H01L25/075
CPCB05C5/001B05C5/0208B05C13/02B05D1/26B05B15/50H01L21/67126H01L25/0753
Inventor 莫雄辉
Owner 安徽绿保电子科技股份有限公司
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