A temperature field measurement system in thermal vacuum test environment

Abstract

The invention discloses a temperature field measurement system in a thermal vacuum test environment, comprising: an infrared temperature measuring head control circuit, a heating plate control circuit, a temperature measurement sensor circuit, a thermal vacuum environment simulation tank body, which is arranged in a thermal vacuum environment simulation tank body The protective cabin measurement and control module, infrared temperature measuring head, flexible large field of view adjustment mechanism heat sink, cold plate, infrared heating lamp array and the test piece, as well as the temperature field measurement software and computer, protection set outside the thermal vacuum environment simulation tank The cabin measurement and control temperature device, protection cabin acquisition and processing system; the protection cabin measurement and control module is set between the heat sink and the infrared heating lamp array; the temperature field measurement software, the computer and the protection cabin measurement and control module communicate with the infrared temperature measuring head, The protection cabin measurement and control temperature device is connected with the protection cabin acquisition and processing system. The invention can effectively realize the non-contact large field of view temperature field measurement on the surface of structural mechanism products, electronic products and the like in a vacuum high and low temperature simulation test environment.

Description

Technical field [0001] The present invention belongs to the field of temperature field measurement, and in particular, the temperature field measurement system in a thermal vacuum test environment. Background technique [0002] During the railway operation, the spacecraft will undergo the limit temperature range - 180 ° C ~ + 180 ° C, the pressure is as low as 10 -5 Vacuum high and low temperature environment. Under space vacuum high and low temperature coupling environment, it may bring product structure deformation and stress concentration, effective load performance, and electronic product reliability, etc., even the risk of overall failure. In order to avoid this risk, ensure the adaptability and reliability of space vacuum high and low temperature in space products in the full life cycle, need to understand the environmental adaptability of the product in advance in the ground development phase to reduce risks. Therefore, the vacuum high and low temperature environment simul...

AI Technical Summary

Problems solved by technology

The contact temperature sensor can only measure the temperature of some points, the measuring points are limited, and the temperature field on the entire surface of the product cannot be measured, and it may not be possible to effectively monitor the local overtemperature and undertemperature conditions of the test

At the same time, the contact sensor will affect the temperature conduction of the product, which may lead to a large temperature measurement error; and the contact temperature measurement cannot be used for products with an untouchable surface or products with a small thermal conductivity, and the sensor is pasted with adhesive tape and pasting methods. The temperature has a great influence, and the test may appear that the paste is not firm and cannot reflect the real temperature situation.

Conventional infrared thermometers are difficult to be directly used for temperature field measurement in vacuum high and low temperature simulation test environments because they are usually used in normal temperature and normal pressure environments, and there are problems of space vacuum and high and low temperature environment adaptability

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