The invention discloses a ceramic material laser processing device and method. According to the ceramic material laser processing device and method, for laser perforating of a ceramic material, the problems that in the prior art, the depth-diameter ratio of a machined through hole is small, the taper is large, the hole wall is prone to breakage are solved, high-quality perforating of the ceramic material is realized, the requirement for micro processing on a ceramic packaging substrate of the ultrahigh-frequency communication electronic industry is met, the processing dip angle of laser perforating is synchronously and orderly regulated and controlled through sequential operation of clockwise rotation, anticlockwise rotation and adjustment of a ceramic chip, and then the hole wall taper iseffectively reduced. Meanwhile, the double-sided processing mode effectively disperses heat accumulation, reduces the temperature gradient, reduces the damage of heat influence on the ceramic material, and reduces the edge breakage of the hole wall. Particularly, under the mode of performing focusing by adopting a cone lens, a bessel space distribution light beam is obtained, namely, a transverselight spot (the transverse direction is the perpendicular light beam propagation direction) after the laser beam is focused is reduced, a longitudinal light spot (the longitudinal direction is the parallel light beam propagation direction) after the laser beam is focused is stretched, the laser utilization rate is effectively improved, and the heat influence is reduced.