Temperature field measurement system in thermal vacuum test environment

Abstract

The invention discloses a temperature field measurement system in a thermal vacuum test environment. The system comprises an infrared temperature measurement head control circuit, a heating plate control circuit, a temperature measurement sensor circuit, a thermal vacuum environment simulation tank body,a protection cabin measurement and control module, an infrared temperature measurement head, aflexible large-view-field adjusting mechanism heat sink, a cold plate, an infrared heating lamp array, a tested piece, temperature field measurement software, a computer, a protection cabin temperature measurement and control device and a protection cabin acquisition and processing system, wherein the protection cabin measurement and control module, the infrared temperature measurement head, the flexible large-view-field adjusting mechanism heat sink, the cold plate, the infrared heating lamp array and the tested piece are arranged in a thermal vacuum environment simulation tank body, and thetemperature field measurement software, the computer, the protection cabin temperature measurement and control device and the protection cabin acquisition and processing system are arranged outside the thermal vacuum environment simulation tank body. The protection cabin measurement and control module is arranged between the heat sink and the infrared heating lamp array; and the temperature fieldmeasurement software, the computer and the protection cabin measurement and control module are connected with the infrared temperature measurement head, the protection cabin temperature measurement and control device and the protection cabin acquisition and processing system through corresponding circuits. According to the invention, surface non-contact large-view-field temperature field measurement of structural mechanism products, electronic products and the like in a vacuum high-low temperature simulation test environment can be effectively realized.

Description

technical field [0001] The invention belongs to the technical field of temperature field measurement, in particular to a temperature field measurement system in a thermal vacuum test environment. Background technique [0002] During the operation of the spacecraft in orbit, it will experience extreme temperatures ranging from -180°C to +180°C and pressures as low as 10 -5 Pa vacuum high and low temperature environment. Under the action of space vacuum, high and low temperature coupling environment, it may cause problems such as product structural deformation and stress concentration, payload performance degradation, electronic product reliability, and even the risk of overall failure. In order to avoid this risk and ensure the adaptability and reliability of the space vacuum high and low temperature environment experienced by aerospace products during the entire life cycle, it is necessary to understand the environmental adaptability of the product in advance during the gro...

AI Technical Summary

Problems solved by technology

The contact temperature sensor can only measure the temperature of some points, the measuring points are limited, and the temperature field on the entire surface of the product cannot be measured, and it may not be possible to effectively monitor the local overtemperature and undertemperature conditions of the test

At the same time, the contact sensor will affect the temperature conduction of the product, which may lead to a large temperature measurement error; and the contact temperature measurement cannot be used for products with an untouchable surface or products with a small thermal conductivity, and the sensor is pasted with adhesive tape and pasting methods. The temperature has a great influence, and the test may appear that the paste is not firm and cannot reflect the real temperature situation.

Conventional infrared thermometers are difficult to be directly used for temperature field measurement in vacuum high and low temperature simulation test environments because they are usually used in normal temperature and normal pressure environments, and there are problems of space vacuum and high and low temperature environment adaptability

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