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Extensible semiconductor test device

A test equipment, semiconductor technology, applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., can solve the problems of equipment cost increase, frequent update of test equipment, equipment can not meet the test requirements, etc., to achieve the effect of test ability and function

Pending Publication Date: 2021-01-29
杭州加速科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the test enterprise installs the actual situation and purchases semiconductor test equipment, with the rapid increase of the test demand, the existing equipment will soon be unable to meet the test demand, and the test equipment needs to be updated frequently
If the test company chooses to configure test equipment in advance on a large scale, the cost of the equipment will increase significantly

Method used

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  • Extensible semiconductor test device
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  • Extensible semiconductor test device

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0024] figure 1 It is a structural diagram of an expandable semiconductor testing device according to an embodiment of the present invention. Such as figure 1 As shown, the semiconductor test equipment includes a main control module 11 , a cascade communication module 12 , a basic test module 13 and a power supply module 14 . The cascade communication module 12 is connected to a plurality of basic test modules 13 . The main control module 1 controls a plurality of basic test modules 13 through the cascaded communication module 12 to realize the test on the semiconductor chip. In this embodiment, the cascade communication module 12 is connected with four basic test modules 13 . In practice, the number of connected basic test modules 13 can be a...

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PUM

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Abstract

The invention discloses an extensible semiconductor test device. The semiconductor test device comprises a main control module (11), a cascade communication module (12) and a basic test module (13). The cascade communication module (12) comprises a plurality of cascade interfaces. The basic test module (13) comprises a communication backboard and a plurality of test resource board cards. The plurality of test resource board cards are connected with each other through the communication backboard. The basic test module is connected with a cascade interface of the cascade communication module (12) through a cable. And the main control module (11) accesses the test resource board cards of the basic test module (13) through the cascade communication module (12). According to the semiconductor test device, the cascaded communication module is adopted to carry out cascaded connection on the basic test module so that semiconductor test enterprises can dynamically adjust the number of the cascaded basic test modules to meet different test requirements.

Description

technical field [0001] The invention relates to the technical field of chip detection, in particular to an expandable semiconductor testing device. Background technique [0002] As the complexity of integrated circuits increases, so does the complexity of testing integrated circuits. For example, large-scale integrated circuits require hundreds of voltage, current, and timing tests, as well as millions of functional test steps to ensure that the device meets the design requirements. It is impossible to complete such a complex test manually, so it is necessary to use semiconductor automatic test equipment ATE (Automated Test Equipment). [0003] The maximum number of test resources that can be supported by semiconductor test equipment in the prior art is fixed. When the semiconductor device to be tested requires more resources, the testing company can only purchase higher-performance equipment to meet the requirements of the testing task. In fact, semiconductor test equipm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2889
Inventor 凌云邬刚
Owner 杭州加速科技有限公司