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Processing equipment and processing method for surface heat dissipation structure of laminated Aln substrate

A technology of substrate surface and heat dissipation structure, used in metal processing equipment, metal processing, milling machine equipment, etc., can solve the problems of AlN thin layer breakage and crack, inapplicability, etc., to reduce cutting force, reduce tool wear, and improve processing efficiency. Effect

Active Publication Date: 2022-03-29
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chip packaging materials usually require good thermal conductivity and thermal conductivity. Laminated AlN ceramics fully meet the above requirements. However, due to its special structure, laminated AlN cannot be applied to traditional machining, and it is easy to break the AlN thin layer. and crack

Method used

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  • Processing equipment and processing method for surface heat dissipation structure of laminated Aln substrate
  • Processing equipment and processing method for surface heat dissipation structure of laminated Aln substrate
  • Processing equipment and processing method for surface heat dissipation structure of laminated Aln substrate

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Experimental program
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Embodiment 1

[0037] see figure 1 , this embodiment provides a processing equipment for heat dissipation structure on the surface of a laminated AlN substrate, the equipment includes: a micro milling machine, an ultrasonic vibration platform 11, a fixture, a laser 6, a gas-liquid supply system and a control system. Among them, the micro-milling machine includes a three-axis servo moving platform and a micro-milling cutter 9; the ultrasonic vibration platform 11 is installed on the three-axis servo moving platform (that is, installed on the X-axis servo platform 13 of the micro-milling machine), located on the micro-milling cutter 9 The lower part is used to place the laminated AlN substrate 15; the fixture is used to clamp and fix the laminated AlN substrate 15 on the ultrasonic vibration platform 11; the laser 6 is a nanosecond laser installed above the ultrasonic vibration platform 11, and its programming The origin corresponds to the programming origin of the ultrasonic vibration platfor...

Embodiment 2

[0042] This embodiment provides a method for processing a heat dissipation structure on a laminated AlN substrate surface. The method is applied to the processing equipment for the heat dissipation structure on a laminated AlN substrate surface provided in Example 1. The method includes:

[0043] Step 1: Clamp the laminated AlN substrate on the ultrasonic vibration platform;

[0044] Step 2: metallize the area to be processed of the laminated AlN substrate by using a laser with a power density of the first set value, and at the same time inject an inert gas to form an atmosphere protection;

[0045] Step 3: Under the vibration of the ultrasonic vibration platform, use the micro milling cutter to remove the metallized area at the first cutting depth, and at the same time pass the cutting fluid;

[0046] Repeat steps 2 to 3 until the rough machining depth is reached;

[0047] Step 4: continue to metallize the processed surface with a laser with a power density of the second set...

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Abstract

The invention discloses a processing equipment and a processing method of a surface heat dissipation structure of a laminated AlN substrate. The method includes: clamping a laminated AlN substrate on an ultrasonic vibration platform; metallizing a to-be-processed area of ​​the substrate with a laser whose power density is a first set value, and introducing an inert gas to form atmosphere protection; Under high vibration, the metallized area is removed by a micro milling cutter at the first depth of cut, and the cutting fluid is introduced at the same time; the above two steps are repeated to complete the rough machining; the laser with the power density of the second set value is used to continue the machining of the surface. Metallization treatment is carried out, and at the same time, inert gas is introduced to form an atmosphere protection; under the vibration of the ultrasonic vibration platform, a micro milling cutter is used to remove the metallized area with a second cutting depth; the above two steps are repeated to complete the finishing. The invention can solve the problems of thin layer breakage and cracks that are easy to occur during processing of the surface heat dissipation structure of the stacked AlN substrate, and has the characteristics of high processing efficiency.

Description

technical field [0001] The invention relates to the field of ceramic processing, in particular to a processing device and a processing method for a heat dissipation structure on the surface of a laminated AlN substrate. Background technique [0002] With the development of computer technology, the amount of calculation begins to increase exponentially, and as the carrier of computer work, the performance of chips is an important factor restricting the development of computers. When the chip is working, it will generate a lot of heat, which will gradually increase the working temperature of the chip. At present, the operating temperature of commercial-grade chips is between 0°C and +70°C, and the operating temperature of industrial-grade chips is between -45°C and +85°C. If the operating temperature of the chip is too high, the working efficiency of the chip will be affected. Low-calorific superconductor chips currently only exist in laboratories. Such chips are expensive an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23C3/00B23P25/00C22F3/00
CPCB23C3/00B23P25/00C22F3/00
Inventor 陈妮张鑫磊韦佳伟李亮何宁
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS