Large-scale integrated circuit chip production, processing and treatment equipment

Abstract

The invention provides large-scale integrated circuit chip production processing equipment, which relates to the technical field of electronic chip production processing, and comprises a support table, a storage rack and a conveying box, wherein the conveying box is horizontally arranged, the storage rack is vertically arranged at the top end of the conveying box, the support table is arranged atthe left end of the conveying box, and the storage rack is arranged at the right end of the conveying box. A heating box is arranged at the right end of the conveying box; a flow channel parallel to the ground is formed in the middle of the conveying box. According to the invention, air is sprayed to the surface of the circuit chip through the air nozzles in the air spraying grooves, coating chippings adhering to the surface of the circuit chip after punching of the punching drill are subjected to air blowing cleaning, and the surface of the circuit chip is clean and tidy; through air sprayingof the air nozzles, based on horizontal sliding of the circuit chip in a flow channel, the air flow sprayed by the air nozzle penetrates into the micropores in the surface of the circuit chip to blowout the coating chipping particles accumulated in the micropores, so that the cleaning of dead angle positions of the circuit chip is further improved, and the cleanness of the surface of the circuitchip is improved.

Description

technical field [0001] The invention relates to the technical field of electronic chip production and processing, in particular to a large-scale integrated circuit chip production and processing equipment. Background technique [0002] Chip is also known as integrated circuit board, or microcircuit board, microchip board. And installation, when the chip is manufactured, it is necessary to open holes on the PCB board so that various components can be fixed and installed on the PCB board. The plated PCB board needs to be baked to increase the adhesion of the PCB board. [0003] At present, Patent No. CN201320277406.5 discloses a tray and chip baking system. By setting stoppers on the bottom plate and the pallet of the oven, the stoppers and side plates, or the stoppers and stoppers form a container and make the width of the bottom wall of the tray match the width of the accommodating grid, so that the pallets that do not match the accommodating grid can be detected through a...

AI Technical Summary

Problems solved by technology

[0006] In view of the problems in the prior art, the purpose of the present invention is to provide a large-scale integrated circuit chip production and processing equipment to solve the existing problem that when the chip is baked, the peritoneum, The ink of the plating layer adheres to the micropores on the surface of the circuit chip. When the circuit chip is baked, it is easy to make the peritoneum and the ink of the plating layer solidify and block the micropores on the surface of the circuit chip, resulting in the complexity of the operation of the circuit chip during installation. Technical problem that is difficult to install in the micro-holes on the surface of circuit chips

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