A large-scale integrated circuit chip production and processing equipment

Abstract

The invention provides a large-scale integrated circuit chip production and processing equipment, which relates to the technical field of electronic chip production and processing, including a support platform, a storage rack, and a delivery box. The delivery box is placed horizontally, and the storage rack is set upright. On the top of the delivery box, the support platform is arranged at the left end of the delivery box, and the right end of the delivery box is provided with a heating box; the middle part of the delivery box is provided with a flow channel parallel to the ground; The nozzle sprays air on the surface of the circuit chip, and blows and cleans the coating debris adhered to the surface of the circuit chip after drilling, so that the surface of the circuit chip is clean, and the air jet through the air nozzle matches the level of the circuit chip in the flow channel. Sliding, the airflow ejected from the air nozzle penetrates into the micropores on the surface of the circuit chip, and blows out the coating debris particles accumulated in the micropores, thereby further improving the cleaning of the dead corners of the circuit chip and improving the cleanliness of the surface of the circuit chip .

Description

technical field [0001] The invention relates to the technical field of electronic chip production and processing, in particular to a large-scale integrated circuit chip production and processing equipment. Background technique [0002] Chip is also known as integrated circuit board, or microcircuit board, microchip board. And installation, when the chip is manufactured, it is necessary to open holes on the PCB board so that various components can be fixed and installed on the PCB board. The plated PCB board needs to be baked to increase the adhesion of the PCB board. [0003] At present, Patent No. CN201320277406.5 discloses a tray and chip baking system. By setting stoppers on the bottom plate and the pallet of the oven, the stoppers and side plates, or the stoppers and stoppers form a container and make the width of the bottom wall of the tray match the width of the accommodating grid, so that the pallets that do not match the accommodating grid can be detected through a...

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Problems solved by technology

[0006] In view of the problems in the prior art, the purpose of the present invention is to provide a large-scale integrated circuit chip production and processing equipment to solve the existing problem that when the chip is baked, the peritoneum, The ink of the plating layer adheres to the micropores on the surface of the circuit chip. When the circuit chip is baked, it is easy to make the peritoneum and the ink of the plating layer solidify and block the micropores on the surface of the circuit chip, resulting in the complexity of the operation of the circuit chip during installation. Technical problem that is difficult to install in the micro-holes on the surface of circuit chips

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