Manufacturing and processing method of PCB

Abstract

The invention relates to a manufacturing and processing method of a PCB, which mainly comprises the following steps: placing a board, clamping the board, polishing the left side, polishing the right side and the like, and a used processing machine comprises a fixed base, a support column, a mounting base, a clamping device and a polishing device. Preferably, supporting columns are fixed to the positions, close to the four corners, of the upper end of the fixed base, the upper ends of the supporting columns are connected through a mounting base, clamping devices are symmetrically arranged on the left side and the right side of the upper end face of the mounting base, and a grinding device is arranged in the middle of the upper end of the mounting base. The problems that according to a traditional PCB surface oxide layer cleaning method, only one face can be cleaned at a time, a clamping face needs to be replaced for cleaning, consequently, the oxide layer cleaning efficiency is not high, cleaning can be affected by a clamping mechanism, the whole surface of a PCB cannot be completely cleaned, and the surface cleaning effect of the PCB is reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board preparation, in particular to a method for manufacturing and processing a PCB circuit board. Background technique [0002] PCB circuit board, also known as printed circuit board, as an important electronic component, is often used as a support for electronic components and a carrier for electrical connections of electronic components. Because it is made by electronic printing, it is called For printed circuit boards, the main advantage of using circuit boards is to greatly reduce wiring and assembly errors, improve automation levels and production labor rates, it can replace complex wiring, and realize electrical connections between components in the circuit, which not only simplifies The assembly and welding of electronic products reduces the workload of wiring in the traditional way and greatly reduces the labor intensity of workers; it also reduces the volume of the whole machine, reduces...

AI Technical Summary

Problems solved by technology

[0005] The invention can solve the problem that the traditional method for cleaning the oxide layer on the surface of the PCB circuit board can only be cleaned on one side at a time, and the clamping surface needs to be replaced for cleaning, resulting in low efficiency of cleaning the oxide layer, and after the PCB circuit board needs to be clamped Clean up again, and the clamping mechanism will affect the cleaning, so that the overall surface of the PCB circuit board cannot be completely cleaned, which reduces the surface cleaning effect of the PCB circuit board. If it is removed from the clamping mechanism for secondary cleaning, it will be wasteful. Issues such as manpower and material resources

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