Slitting equipment for semiconductor ceramic capacitor chip production

Abstract

The invention discloses slitting equipment for semiconductor ceramic capacitor chip production. The slitting equipment for semiconductor ceramic capacitor chip production structurally comprises a slitting box, a controller, air cylinders and a collecting box, the controller is connected to the front side of the slitting box in a welded mode, the air cylinders are installed at the top of the slitting box, and the collecting box is connected to the front side of the slitting box in a movable clamping mode. The slitting equipment for semiconductor ceramic capacitor chip production has the beneficial effects that a semiconductor ceramic capacitor chip is placed on a pushing device, at the moment, the two sides of the semiconductor ceramic capacitor chip move downwards along the inner walls ofclamping blocks, clamping plates clamp the semiconductor ceramic capacitor chip under the elastic force of supporting springs, the semiconductor ceramic capacitor chip is prevented from shaking and deviating in the conveying process, the air cylinders are started through the controller to convey air to an air pressure cavity, the air pressure in the air pressure cavity is increased to enable a slitting head to descend, meanwhile, a push plate downwards extrudes limiting springs to enable a slitting knife to slit the semiconductor ceramic capacitor chip, and pressing blocks press the two sidesof the semiconductor ceramic capacitor chip to prevent the two sides of the semiconductor ceramic capacitor chip from tilting in the slitting process.

Description

technical field [0001] The invention relates to the field of conductor ceramics, in particular to a cutting device for the production of semiconductor ceramic capacitor chips. Background technique [0002] Semiconductor ceramics refer to ceramics with semiconductor characteristics. When producing and processing semiconductor ceramic capacitor chips, it is necessary to use slitting equipment to cut the semiconductor ceramic capacitor chips into pieces. The capacitor chips are pushed into the collection box to prevent the cut semiconductor ceramic capacitor chips from accumulating on the cutting equipment. [0003] At present, there is a cutting device for the production of semiconductor ceramic capacitor chips. When the cutting device cuts the semiconductor ceramic capacitor chips, the cylinder pushes the telescopic rod to make the cutting knife press down on the surface of the semiconductor ceramic capacitor chip, so that the semiconductor ceramic capacitor chip The surface...

AI Technical Summary

Problems solved by technology

[0003] At present, there is a cutting device for the production of semiconductor ceramic capacitor chips. When the cutting device cuts the semiconductor ceramic capacitor chips, the cylinder pushes the telescopic rod to make the cutting knife press down on the surface of the semiconductor ceramic capacitor chip, so that the semiconductor ceramic capacitor chip The surface of the chip is depressed until it is cut off, and the unpressed sides of the semiconductor ceramic capacitor chip are lifted during the pressing process of the slitting knife, resulting in the uneven cutting surface of the slitting knife, which affects the use of the semiconductor ceramic capacitor chip after slitting

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