A 5g chip packaging equipment
A chip packaging and equipment technology, applied in electrical components, circuits, semiconductor/solid-state device manufacturing, etc., can solve problems such as positioning and installation operations, chip wear, and low work efficiency, and achieve the effect of avoiding wear and damage.
Active Publication Date: 2021-11-09
上海玖伍电子科技有限公司
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Problems solved by technology
[0006] In order to solve the above technical problems, the present invention provides a 5G chip packaging equipment to solve the problem that the existing 5G chip packaging equipment still needs clamps to clamp the chip for positioning and installation after clamping in the actual application process. Chips are clamped and contacted to cause chip wear and damage. Moreover, it is impossible to quickly locate and install batches of chips, which will cause low work efficiency.
Method used
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Embodiment
[0029] as attached figure 1 to attach Figure 6 Shown:
[0030]The present invention provides a 5G chip packaging equipment, including: a stepping feeding mechanism 3 and a shifting mechanism 4, the stepping feeding mechanism 3 is engaged and driven at the top position of the carrying mechanism 1, and the top of the stepping feeding mechanism 3 Also fixedly connected to the limit mechanism 2; the displacement mechanism 4 is slidably connected to the top position of the bearing mechanism 1, the bearing mechanism 1 includes a base 101, a support frame 102 and a hand wheel 103, and the support frame 102 is fixedly connected to the top of the base 101 The bearing mechanism 1 also includes a screw 104, a bevel gear A105 and a bevel gear B106, the screw 104 is fixedly connected to the left end of the hand wheel 103, and the screw 104 is rotatably connected to the inner position of the support frame 102, and the bevel gear A105 is fixed Connected to the left end face of the screw r...
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The invention provides a 5G chip packaging equipment, which relates to the technical field of chip packaging, and solves the problem that the existing 5G chip packaging equipment still needs a clamp to clamp the chip for positioning and installation after the chip is clamped in the actual application process. Chips are clamped and contacted to cause wear and damage to the chips. Furthermore, it is impossible to quickly locate and install batches of chips, which will cause low work efficiency, including the step-by-step feeding mechanism. The feeding mechanism is engaged and driven at the top position of the carrying mechanism. In the present invention, the adjustment screw in the limit mechanism can be manually rotated to achieve the purpose of pushing the pressure plate down through the adjustment screw until it contacts the circuit board, and in order to prevent The circuit board is overrun and crushed, and anti-overtravel springs are installed at the bottom of the four pillars, so it can effectively protect the circuit board further.
Description
technical field [0001] The invention belongs to the technical field of chip packaging, and more specifically relates to a 5G chip packaging equipment. Background technique [0002] Chip packaging is a shell for installing semiconductor integrated circuit chips. It plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance. It is also a bridge between the internal world of the chip and the external circuit-the contacts on the chip are connected to On the pins of the package shell, these pins are connected to other devices through the wires on the printed board. Therefore, packaging plays an important role for CPUs and other LSI integrated circuits; [0003] For small chips and circuit boards, tweezers and other tools are often used to clamp the chips for positioning and installation during the contact and installation process. Therefore, there will be a certain fixed economic loss. [0004] For example, application number: ...
Claims
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IPC IPC(8): H01L21/683H01L21/68
CPCH01L21/68H01L21/6838
Inventor 刘敏
Owner 上海玖伍电子科技有限公司